Amazing Works.

  • Year 2020
    1. Jun-Nan Liu, Manik Chandra Sil, Rui Cheng, Shien-Ping Feng, and Chih-Ming Chen, 2020, “Surface silanization of polyimide for autocatalytic metallization”, JOM, Accepted for publication. (10.1007/s11837-020-04286-2)
    2. Manik Chandra Sil, Li-Syuan Chen, Chin-Wei Lai, Cheng-Chung Chang, and Chih-Ming Chen, 2020, “Enhancement of Solar Efficiency of Dye-Sensitized Solar Cell by Molecular Engineering of Organic Dye Incorporating N-alkyl Attached 1, 8-Naphthalamide Derivative”, Journal of Materials Chemistry C, Accepted for publication. (https://doi.org/10.1039/D0TC01388A) (Selected as “Back Cover”)
    3. Tzu-Jung Liu, Manik Chandra Sil, and Chih-Ming Chen, 2020 June, “Well-organized Organosilane Composites for Adhesion Enhancement of Heterojunctions”, Composites Science and Technology, Vol. 193, 108135.
    4. Ping‑Heng Wu, Yu-Zhong Lai, Yan-Ping Zhang, Manik Chandra Sil, Po-Heng (Henry) Lee, Tzu-Chien Wei, and Chih-Ming Chen, 2020 April, “Organosiloxane Monolayers Terminated with Amine Groups as Adhesives for Si Metallization”, ACS Applied Nano Materials, Vol. 3, pp. 3741-3749.
    5. Yi-Hsuan Chen, Yi-Hsiang Lai, Ping‑Heng Wu, Li-Syuan Chen, Yung-Sen Lin, and Chih-Ming Chen, 2020 March, “Mutual Intercropping-inspired Co-silanization to Graft Well-oriented Organosilane as Adhesion Promotion Nanolayer for Flexible Conductors”, Journal of Industrial and Engineering Chemistry, Vol. 83, pp. 90-99.
    6. Jenn-Ming Song, Po-Jen Wang, Lap-Hong Chan, Chih-Ming Chen, Wen-Fu Ho, and Shih-Yun Chen, 2020 February, “Efficiency Enhancement of Dye-Sensitized Solar Cells Using Ti-Nb Alloy Photoanodes with Mesoporous Oxide Surface”, Journal of The Electrochemical Society, Vol. 167, pp. 046501.
    7. Po-Fan Chan, Hsuan Lee, Shih-I Wen, Mao-Chun Hung, Chih-Ming Chen, and Wei-Ping Dow, 2020 February, “Effect of Copper Grain Size on The Interfacial Microstructure of Sn/Cu Joint”, ACS Applied Electronic Materials, Vol. 2, pp. 464-472.
    8. Chia-Yuan Chen, Ting-Yang Kuo, Chien-Wu Huang, Zih-Hong Jian, Po-Tsung Hsiao, Chin-Li Wang, Jian-Ci Lin, Chien-Yu Chen, Chao-Hsuan Chen, Yung-Liang Tung, Ming-Chi Tsai, Kuan-Min Huang, Chih-Ming Chen, Cheng-Wei Hsu, Yen-Chiao Chen, Zingway Pei, Yogesh S. Tingare, Hsien-Hsin Chou, Chen-Yu Yeh, Ching-Yao Lin, Yuh-Lang Lee, Hao-Wu Lin, Hsin-Fei Meng, Chun-Guey Wu, and Pi-Tai Chou, 2020 February, “Thermal and angular dependence of next-generation photovoltaics under indoor lighting”, Progress in Photovoltaics: Research and Applications, Vol. 28, pp. 111-121.
    9. Yu-Wen Chen, Manik Chandra Sil, and Chih-Ming Chen, 2020 February, “Increasing Solar Light Efficiency by Engineering Cell Structures with Modified Ti Foil and Specific Concentrations of Electrolyte in Liquid Dye-Sensitized Solar Cells”, Electrochimica Acta, Vol. 334, pp. 135631 (11 pages).
    10. Chia-Yu Liu, Po-Cheng Kuo, Chih-Ming Chen, Jia-Ying Dai, Yee-Wen Yen, and Alberto S. Pasana, 2020 January, “Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate”, Journal of Electronic Materials, Vol. 49, pp. 257-267.
  • Year 2019
    1. Kai-Wen Chen, Li-Syuan Chen, and Chih-Ming Chen, 2019 August, “Post-treatment of Nb2O5 Compact Layer in Dye-sensitized Solar Cells for Low-level Lighting Applications”, Journal of Materials Science: Materials in Electronics, Vol. 30, pp. 15105-15115.
    2. Shan-Ting Tsai, Ping-Chen Chiang, Chang Liu, Shien-Ping Feng, and Chih-Ming Chen, 2019 September, “Suppression of Void Formation at Sn/Cu joint Due to Twin Formation in Cu Electrodeposit”, JOM, Vol. 71, pp. 3012-3022. (Selected as Journal Cover)
    3. Tzu-Jung Liu, Chien-Han Chen, Pei-Yu Wu, Ching-Hsuan Lin, and Chih-Ming Chen, 2019 June, “Efficient and Adhesiveless Metallization of Flexible Polyimide by Functional Grafting of Carboxylic Acid Groups”, Langmuir, Vol. 35, pp. 7212-7221.
    4. Zeyang Zheng, Ping-Chen Chiang, Yu-Ting Huang, Wei-Ting Wang, Po-Chien Li, Ya-Hui Tsai, Chih-Ming Chen, and Shien-Ping Feng, 2019 August, “Study of grain size effect of Cu metallization on interfacial microstructures of solder joints”, Microelectronics Reliability, Vol. 99, pp. 44-51.
    5. Hsuan-Ling Hsu, Hsuan Lee, Chi-Wei Wang, Chenju Liang, and Chih-Ming Chen, 2019 March, “Impurity evaporation and void formation in Sn/Cu solder joints”, Materials Chemistry and Physics, Vol. 225, pp. 153-158.
    6. Hsuan Lee, Shan-Ting Tsai, Ping-Heng Wu, Wei-Ping Dow, and Chih-Ming Chen, 2019 January, “Influence of Additives on Electroplated Copper Films and Their Solder Joints”, Materials Characterization, Vol. 147, pp. 57-63.
    7. Yee-Wen Yen, William Yu, Chu-Hsuan Wang, Chih-Ming Chen, Yu-Chun Li, Pei-Yu Chen, and Guan-Da Chen, 2019 January, “Study of Interfacial Reactions between Lead-free Solders and Cu-xZn Alloys”, Journal of Electronic Materials, Vol. 48(1), pp. 170-181.
  • Year 2018
    1. Hsuan Lee,Yi-An Wang,and Chih-Ming Chen, 2018 October,“Development of nanotwins in electroplated copper and its effect on shear strength of tin/copper joint”,Journal of Alloys and Compounds,Vol. 765,pp. 335-342.
    2. Hsuan-Ling Hsu,Hsuan Lee,Ping-Heng Wu,Yee-Wen Yen,and Chih-Ming Chen, 2018 August,“Impurity-induced Unusual Microstructural Evolution and Mechanical Property in Sn/Cu Solder Joints”,Journal of Materials Science: Materials in Electronics,Vol. 29(15),pp. 12842-12849.
    3. Yen-Chiao Chen,Ya-Ching Chang,and Chih-Ming Chen, 2018 July,“The Study of Blocking Effect of Nb2O5 in Dye-sensitized Solar Cells under Low Power Lighting”,Journal of The Electrochemical Society,Vol. 165 (7),pp. F409-F416.
    4. Hsuan Lee and Chih-Ming Chen, 2018 June,“Impurity Effects in Electroplated-Copper Solder Joints”,Metals,Vol. 8(6),388 (17 pages).
    5. Ying-Chen Chiang,Zi-Lun Lai,Chih-Ming Chen, Cheng-Chung Chang,and Bin Liu,2018,“Construction of emission-tunable nanoparticles based on a TICT-AIEgen: Impact of aggregation-induced emission versus twisted intramolecular charge transfer”,Journal of Materials Chemistry B,Vol. 6,pp. 2869-2876.
    6. Chih-Hsiang Huang, Yu-Wen Chen, and Chih-Ming Chen, 2018, "Chromatic Titanium Photoanode for Dye-Sensitized Solar Cells under Rear Illumination", ACS Applied Materials & Interfaces, Accepted for publication. (DOI: 10.1021/acsami.7b18351)
    7. Kamani Reddy, Yen-Chiao Chen, Chih-Chung Wu, Chia-Wei, Hsu, Ya-Ching Chang, Chih-Ming Chen, and Chen-Yu Yeh, 2018, "Co-sensitization of Structurally Simple Porphyrin and Anthracene-based Dye for Dye-Sensitized Solar Cells", ACS Applied Materials & Interfaces, Accepted for publication. (DOI: 10.1021/acsami.7b12960)
    8. Gita Novian Hermana, Tzu-Ting Huang, Chih-Ming Chen, Chin-Hung Lin, Satoshi Iikubo, and Yee-Wen Yen, 2018 February, “Phase Equilibria of the Cu-Ni-Zr Ternary Systems at 800 °C and Thermodynamic Assessment and Metallic Glass Region Prediction for the Cu-Ni-Zr Ternary System”, Journal of Non-Crystalline Solids, Vol. 481: 1, pp. 612-621.
    9. Yu-Chen Tseng, Hsuan Lee, Nga Yu Hau, Shien-Ping Feng, and Chih-Ming Chen, 2018 January, “Electrodeposition of Ni on Bi2Te3 and Interfacial reaction between Sn and Ni-coated Bi2Te3”, Journal of Electronic Materials, Vol. 47 (1), pp. 27-34. (DOI: 10.1007/s11664-017-5777-1)
  • Year 2017
    1. Yeng-Fong Shih, Man-Yun Chou, Wen-Chuan Chang, Hong-Yuan Lian, and Chih-Ming Chen, 2017 November, “Completely Biodegradable Composites Reinforced by the Cellulose Nanofibers of Pineapple Leaves Modified by Eco-friendly Methods”, Journal of Polymer Research, Vol. 24: 209, pp. 1-12.
    2. Jyun-Wei Chen, Chih-Ming Chen, and Cheng-Chung Chang, 2017 September, “A fluorescent pH probe for acidic organelle in living cells”, Organic & Biomolecular Chemistry, Vol. 15, pp. 7936-7943.
    3. Pei-Yu Wu, Ching-Hsuan Lin, and Chih-Ming Chen, 2017 May, “Study of Surface Metallization of Polyimide Film and Interfacial Characterization”, Metals, Vol. 7, pp. 189 (12 pages).
    4. Hsuan Lee, Tai-Yi Yu, Hsi-Kuei Cheng, Kuo-Chio Liu, Po-Fan Chan, Wei-Ping Dow*, and Chih-Ming Chen, 2017 July, “Impurity Incorporation in the Cu Electrodeposit and Its Effects on the Microstructural Evolution of the Sn/Cu Solder Joints”, Journal of The Electrochemical Society, Vol. 164, pp. D457-D462.
    5. Yu-Jie Lin, Jyun-Wei Chen, Po-Tsung Hsiao, Yung-Liang Tung, Cheng-Chung Chang, and Chih-Ming Chen, 2017 April, “Efficiency Improvement of Dye-sensitized Solar Cells by In-situ Fluorescence Resonance Energy Transfer”, Journal of Materials Chemistry A, Vol. 5, pp. 9081-9089. (DOI: 10.1039/C7TA00638A).
    6. Chia-Yuan Chen, Zih-Hong Jian, Shih-Han Huang, Kun-Mu Lee, Ming-Hsuan Kao, Chang-Hong Shen, Jia-Min Shieh, Chin-Li Wang, Chiung-Wen Chang, Bo-Zhi Lin, Ching-Yao Lin, Ting-Kuang Chang, Yun Chi, Cheng-Yu Chi, Wei-Ting Wang, Yian Tai, Ming-De Lu, Yung-Liang Tung, Po-Ting Chou, Wen-Ti Wu, Tahsin J. Chow, Peter Chen, Xiang-Hao Luo, Yuh-Lang Lee, Chih-Chung Wu, Chih-Ming Chen, Chen-Yu Yeh, Miao-Syuan Fan, Jia-De Peng, Kuo-Chuan Ho, Yu-Nan Liu, Hsiao-Yi Lee, Chien-Yu Chen, Hao-Wu Lin, Chia-Te Yen, Yu-Ching Huang, Cheng-Si Tsao, Yu-Chien Ting, Tzu-Chien Wei, and Chun-Guey Wu, 2017 April, “Performance Characterization of Dye-Sensitized Photovoltaics Under Indoor Lighting”, Journal of Physical Chemistry Letters, Vol. 8 (8), pp. 1824-1830.
    7. Yu-Chen Tseng, Hsuan Lee, Shan-Chen Tsai, Yee-Wen Yen, and Chih-Ming Chen, 2017 June, “Suppression Effect of Ni Grain Size on the Ni3Sn4 Growth at the Sn/Ni Interface”, Materials Characterization, Vol. 128, pp. 232-237. (doi.org/10.1016/j.matchar.2017.04.013).
    8. Chih-Fan Lin, Nga Yu Hau, Yu-Ting Huang, Ya-Huei Chang, Shien-Ping Feng, Chih-Ming Chen, 2017 June, “Synergetic effect of Bi2Te3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi2Te3 joints”, Journal of Alloys and Compounds, Vol. 708, pp. 220-230.
  • Year 2016
    1. Tai-Yi Yu, Hsuan Lee, Hsuan-Ling Hsu, Wei-Ping Dow, Hsi-Kuei Cheng, Kuo-Chio Liu, and Chih-Ming Chen, October 2016, “Effects of Cu electroplating formulas on the interfacial microstructures of Sn/Cu joints”, Journal of The Electrochemical Society, Vol. 163, pp. D734-741.
    2. Tzu-Ting Huang, Shih-Wei Lin, Chih-Ming Chen, Pei-Yu Chen, and Yee-Wen Yen, December 2016, “Phase Equilibria of the Fe-Ni-Sn Ternary System at 270 oC”, Journal of Electronic Materials, Vol. 45, pp. 6208-6213.
    3. Tzu-Hao Wang, Hsuan Lee, Chih-Ming Chen, Ming-Guan Chen, Chi-Chang Hu, Yu-Jie Chen, and Ray-Hua Horng, August 2016, “Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material”, Microelectronics Reliability, Vol. 63, pp. 68-75.
    4. Ting-Chien Liu, Chih-Chung Wu, Chih-Hsiang Huang, and Chih-Ming Chen, December 2016, “Effects of Ethyl Cellulose on Performance of Titania Photoanode for Dye-sensitized Solar Cells”, Journal of Electronic Materials, Vol. 45, pp. 6192-6199.
    5. Kuei-Chang Lai, Pei-Yu Wu, Chih-Ming Chen, Tzu-Chien Wei, Chung-Han Wu, and Shien-Ping Feng, October 2016, “Interfacial characterizations of a nickel-phosphorus layer electrolessly deposited on a silane-compound-modified silicon wafer under thermal annealing”, Journal of Electronic Materials, Vol. 45, pp. 4813-4822.
    6. H.-K. Cheng, Y.-J. Lin, C.-M. Chen, K.-C. Liu, Y.-L. Wang, and T.-F. Liu, August 2016, “Microstructural evolution of Cu/solder/Cu pillar-type structures with different diffusion barriers”, Metallurgical and Materials Transactions A, Vol. 47, pp. 3971-3980.
    7. H.-M. Hsiao, Y.-W. Chang, C.-M. Chen, P.-Y. Chen, Y.-P. Wu, Y.-W. Yen, July 2016, “Phase equilibria in the Au-Bi-Sn ternary system at temperatures of 80, 125, and 150 oC”, International Journal of Materials Research, Vol. 107, pp. 615-623.
    8. 20. H.-T. Chan, C.-F. Lin, Y.-W. Yen, and C.-M. Chen, May 2016, “Effects of current stressing on the p-Bi2Te3/Sn interfacial reactions”, Journal of Alloys and Compounds, Vol. 668, pp. 91-96.
  • Year 2015
    1. L.-C. Cheng, C.-M. Chen, M.-G. Chen, C.-C. Hu, H.-Y. Jiang, R.-H. Horng and D.-S. Wuu, 2015 August, “A high-temperature die-bonding structure fabricated at low temperature for light-emitting diodes”, IEEE Electron Device Letters, Vol. 36, pp. 835-837.
    2. S. Ye, J.-D. Hwang, and C.-M. Chen, 2015 June, “Strong anisotropic effects of p-type Bi2Te3 element on the Bi2Te3/Sn interfacial reactions”, Metallurgical and Materials Transactions A, Vol. 46, pp. 2372-2375.
    3. H.-K. Cheng, Y.-J. Lin, H.-C. Chang, K.-C. Liu, Y.-L. Wang, T.-F. Liu, and C.-M. Chen, 2015 May, “Unusual morphological evolution of the Cu pillar/solder micro-joints during high-temperature annealing”, Metallurgical and Materials Transactions A, Vol. 46, pp. 1834-1837.
    4. T.-C. Wei, T.-C. Pan, C.-M. Chen, K.-C. Lai, and C.-H. Wu, 2015 May, “Annealing-free adhesive electroless deposition of nickel/phosphorous layer on silane-compound modified Si wafer”, Electrochemistry Communications, Vol. 54, pp. 6-9.
    5. Y.-W. Yen, C.-W. Chiu, C.-M. Chen, M.-T. Lai, and J.-Y. Dai, 2015 March, “Interfacial Reactions in Sn/Ni-xW Couples”, Journal of Electronic Materials, Vol. 44, pp. 909-915.
    6. C.-C. Chou, K.-Y. Tsao, C.-C. Wu, H. Yang, and C.-M. Chen, 2015 February, “Improved power conversion efficiency for dye-sensitized solar cells using a subwavelength-structured antireflective coating”, Applied Surface Science, Vol. 328, pp. 198-204.
    7. H.-K. Cheng, C.-W. Huang, H. Lee, Y.-L. Wang, T.-F. Liu, and C.-M. Chen, 2015 February, “Interfacial Reactions between Cu and SnAgCu solder doped with minor Ni”, Journal of Alloys and Compounds, Vol. 622, pp. 529-534.
    8. T.-K. Yang, C.-F. Lin, and C.-M. Chen, 2015 January, “Interfacial Reactions between Cu-Ag alloy substrates and Sn”, Journal of Electronic Materials, Vol. 44, pp. 511-517.
    9. Y.-J. Lin, C.-C. Chang, S.-J. Cherng, J.-W. Chen, and C.-M. Chen, 2015 January, “Manipulation of light harvesting for efficient dye-sensitized solar cell by doping an ultraviolet light-capturing fluorophore”, Progress in Photovoltaics: Research and Applications, Vol. 23, pp. 106-111.
  • Year 2014
    1. C.-F. Lin, C.-M. Chen, W.-P. Dow, H.-H. Liu, H.-C. Tien, S.-F. Lee, and W.-M. Chen, 2014 October, "Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 4, pp. 1739-1744.
    2. J.-Y. Wu, H. Lee, C.-H. Wu, C.-F. Lin, W.-P. Dow, and C.-M. Chen, 2014 October, "Effects of Electroplating Additives on the Interfacial Reactions between Sn and Cu Electroplated Layers", Journal of The Electrochemical Society, Vol. 161, pp. D522-D527.
    3. F.-C. Hsu, Y.-C. Cheng, Y.-T. Wang, M.-T. Lin, C.-M. Chen, 2014 June-July, "Planar copper-tin intermetallic film formation on strained substrates", Microelectronics Reliability, Vol. 54, pp. 1378-1383.
    4. Y.-H. Chang, Y.-T. Huang, M.-K. Lo, C.-F. Lin, C.-M. Chen, S.-P. Feng, 2014 June, "Electrochemical Fabrication of Transparent Nickel Hydroxide Nanostructures with Tunable Superhydrophobicity/Superhyrophilicity for 2D Microchannels Application", Journal of Materials Chemistry A, Vol. 2, pp. 1985-1990.
    5. P.-K. Chuang, Y.-J. Lin, C.-M. Chen, and C.-C. Chang, 2014 June, "Improved power conversion efficiency of dye-sensitized solar cells by fluorophore-assisted spectrum down-conversion", Journal of The Electrochemical Society, Vol. 161, pp. H404-H409.
    6. C.-P. Lin, C.-M. Chen and Y.-W. Yen, 2014 April, "Enhanced growth of the Cu6Sn5 phase in the Sn/Ag/Cu and Sn/Cu multilayers subjected to applied strain", Journal of Alloys and Compounds, Vol. 591, pp. 297-303.
    7. F. Xie, S.-J. Cherng, S. Lu, Y.-H. Chang, W. Sha, S.-P. Feng, C.-M. Chen, W. Choy, 2014 March, "The Functions of Self-assembled Ultrafine TiO2 Nanocrystals for High Efficient Dye-Sensitized Solar Cells", ACS Applied Materials & Interfaces, Vol. 6, pp. 5367-5373.
    8. H.-K. Cheng, S.-P. Feng, Y.-J. Lai, K.-C. Liu, Y.-L. Wang, T.-F. Liu, and C.-M. Chen, 2014 March, "Effect of Polyimide Baking on Bump Resistance in Flip-Chip Solder Joints", Microelectronics Reliability, Vol. 54, pp. 629-632.
    9. H.-F. Ting, C.-M. Chen, F.-H. Lu, S.-Y. Suen, 2014 March, "Adsorption and photodegradation of methylene blue using a bulk Ti material with porous titania layer prepared by chemical oxidation", Journal of the Taiwan Institute of Chemical Engineers, Vol. 45, pp. 617-624.
    10. Y.-W. Yen, R.-S. Syu, C.-M. Chen, C.-C. Jao, G.-D. Chen, 2014 January, "Interfacial Reactions of Sn-58Bi and Sn-0.7Cu Lead-free Solders with Alloy42 Substrate Microelectronics Reliability", Microelectronics Reliability, Vol. 54, pp. 233-238.
    11. J.-Y. Wang, C.-M. Chen, and Y.-W. Yen, 2014 January, "Interfacial reactions of high-Bi alloys on various substrates", Journal of Electronic Materials, Vol. 43, pp. 155-165.
  • Year 2013
    1. C.-Y. Hsu, S.-J. Cherng, Y.-J. Lin and C.-M. Chen, 2013 November, “A Compact Nano-TiO2 Underlayer for Efficient Dye-sensitized Solar Cell”, IEEE Electron Device Letters, Vol. 34, pp. 1415-1417.
    2. Y.-T. Huang, Y.-Y. Zhan, S.-J. Cherng, C.-M. Chen, S.-P. Feng, T.-C. Wei, 2013 September, "Surface metallization of polyimide as a photoanode substrate for rear-illuminated dye-sensitized solar cells", Journal of The Electrochemical Society, Vol. 160, H581-H586.
    3. Y.-T. Huang, S.-P. Feng, and C.-M. Chen, 2013 June, “Nickel Substrate covered with a Sn-based Protection Bi-layer as a Photoanode Substrate for Dye-sensitized Solar Cells”, Electrochimica Acta, Vol. 99, pp. 230-237.
    4. T.-Y. Tsai, C.-M. Chen, S.-J. Cherng, and S.-Y. Suen, 2013 March, “An efficient titanium-based photoanode for dye-sensitized solar cell under back-side illumination”, Progress in Photovoltaics: Research and Applications, Vol. 21, pp. 226-231.
    5. C.-P. Lin and C.-M. Chen, 2013 January, “The cross-interactions in the Ni/Sn/Cu diffusion couples with an electroless palladium surface finish”, Journal of Alloys and Compounds, Vol. 547, pp. 37-42.
    6. J.-Y. Wu, C.-M. Chen, R.-H. Horng, and D.-S. Wuu, 2013 January, “An efficient metal-core printed-circuit board with a copper-filled through (blind) hole for light-emitting diodes”, IEEE Electron Device Letters, Vol. 34, pp. 105-107.
    7. P.-H. Lee, C.-P. Lin, and C.-M. Chen, 2013 January, “Retardation of the Cu5Zn8 phase fracture and improvement of shear strength of the Sn-9 wt.% Zn/Cu interface by inserting an electroless Palladium layer”, Metallurgical and Materials Transactions A, Vol. 44A, pp. 125-130.
  • Year 2012
    1. T.-C. Wei, S.-P. Feng, Y.-H. Chang, S.-J. Cherng, Y.-J. Lin, C.-M. Chen, H.-H. Chen, 2012 December, “Fabrication and Characterization of Interconnected Grid-type Dye-Sensitized Solar Modules”, International Journal of Electrochemical Science, Vol. 7, pp. 11904-11916.
    2. J.-Y. Wang, C.-F. Lin, and C.-M. Chen, 2012 December, “Interfacial reactions and mechanical properties of the Bi-x wt.% Sn/Cu joints (x= 2, 5, and 10)”, Journal of Electronic Materials, Vol. 41, pp. 3303-3308.
    3. H.-A. Pan, C.-P. Lin, and C.-M. Chen, 2012 September, “Interfacial reaction of molten Sn on a strained Cu electroplated layer”, Journal of Electronic Materials, Vol. 41, pp. 2470-2477.
    4. C.-F. Lin, S.-H. Lee, and C.-M. Chen, 2012 August, “Effect of Sn grain orientation on the Cu6Sn5 formation in a Sn-based solder under current stressing”, Metallurgical and Materials Transactions A, Vol. 43A, pp. 2571-2573.
    5. B.-H. Liou, C.-M. Chen, R.-H. Horng, Y.-C. Chiang, and D.-S. Wuu, 2012 May, ”Improvement of thermal management of high-power GaN-based light-emitting diodes”, Microelectronics Reliability, Vol. 52, pp. 861-865.
    6. C.-P. Lin and C.-M. Chen, 2012 February, “Solid-state interfacial reactions at the solder joints employing Ni/Pd/Au and Ni/Au as the surface finish metallizations”, Microelectronics Reliability, Vol. 52, pp. 385-390.
  • Year 2011
    1. W.-K. Liao, C.-M. Chen, M.-T. Lin, C.-H. Wang, 2011 October, “Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains”, Scripta Materialia, Vol. 65, pp. 691-694.
    2. S.-H. Lee and C.-M. Chen, 2011 September, “Electromigration in a Sn-3wt.%Ag-0.5wt.%Cu-3wt.%Bi solder stripe between two Cu electrodes under current stressing”, Journal of Electronic Materials, Vol. 40, pp. 1943-1949.
    3. S.-J. Cherng, C.-M. Chen, W.-P. Dow, C.-H. Lin, and S.-W. Chen, 2011 July, “Chemical deposition of Ni/Pt bi-layer on polyimide film as flexible counterelectrodes for dye-sensitized solar cells”, Electrochemical and Solid State Letters, Vol. 14, P13-P15.
    4. Y.-T. Huang, Y.-W. Lin, and C.-M. Chen, 2011 May, “Characterization of carbon nanomaterials synthesized from thermal decomposition of paper phenolic board”, Materials Chemistry and Physics, Vol. 127, pp. 397-404.
    5. J.-L. Lan, C.-C. Wan, T.-C. Wei, W.-C. Hsu, C. Peng, Y.-H. Chang, and C.-M. Chen, 2011 May, “Improvement of Photovoltaic Performance of Dye-Sensitized Solar Cell by Post Heat Treatment of Polymer-Capped Nano-Platinum Counterelectrode”, International Journal of Electrochemical Science, Vol. 6, pp. 1230-1236.
    6. J.-Y. Wang, C.-F. Lin, and C.-M. Chen, 2011 April, “Retarding the Cu5Zn8 phase fracture at the Sn-9 wt.% Zn/Cu interface”, Scripta Materialia, Vol. 64, pp. 633-636.
    7. C.-M. Chen, Y.-C. Hsu, and S.-J. Cherng, 2011 January, “Effects of annealing conditions on the properties of TiO2/ITO-based photoanode and the photovoltaic performance of dye-sensitized solar cells”, Journal of Alloys and Compounds, Vol. 509, pp. 872-877.
  • Year 2010
    1. C.-J. Chen, C.-M. Chen, R.-H. Horng, D.-S. Wuu, and J.-S. Hong, 2010 December, “Thermal management and interfacial properties in high-power GaN-based light-emitting diodes employing diamond-added Sn-3wt.%Ag-0.5wt.%Cu solder as die attach materials”, Journal of Electronic Materials, Vol. 39, pp. 2618-2626.
    2. C.-M. Chen, C.-H. Chen, S.-J. Cherng, and T.-C. Wei, 2010 November, “Electroless deposition of platinum on indium tin oxide glass as the counterelectrode for dye-sensitized solar cells”, Materials Chemistry and Physics, Vol. 124, pp. 173-178.
    3. J.-S. Hong, R.-H. Horng*, Y.-L. Tsai, D.-S. Wuu, C.-M. Chen, and C.-J. Chen, 2010 September, “Optimized Thermal Management from Chip to Heat Sink for High-Power GaN-Based Light-Emitting Diodes”, IEEE Transactions on Electron Devices, Vol. 57, pp. 2203-2207.
    4. S.-J. Cherng, Y.-C. Hsu, and C.-M. Chen, 2010 September, “Mitigation of Solvent Evaporation in Dye-Sensitized Solar Cells Based on Liquid Electrolyte by Introducing Regular-fencing-patterned Polymer Films”, Journal of the Chinese Institute of Engineers, Vol. 33, pp. 791-797.
    5. C.-P. Lin, C.-M. Chen, C.-H. Lin, and W.-C. Su, 2010 July, “Interfacial reactions of Sn/Ag/Cu tri-layer on a deformed polyimide substrate”, Journal of Alloys and Compounds, Vol. 502, pp. L17-L19.
    6. Y.-W. Lin, P.-Y. Shih, and C.-M. Chen, 2010 March, “A current-induced localized heating technique for fabrication of carbon nanomaterials”, Journal of Alloys and Compounds, Vol. 492, pp. 521-524.
    7. C.-M. Chen, C.-H. Chen, and T.-C. Wei, 2010 February, “Chemical deposition of platinum on metallic sheets as counterelectrodes for dye-sensitized solar cells”, Electrochimica Acta, Vol. 55, pp. 1687-1695.
  • Year 2009
    1. C.-M. Chen, H.-S. Shiu, S.-J. Cherng, and T.-C. Wei, MAR 2009, “Preparation of polymer film of micro-porous or island-like structure and its application in dye-sensitized solar cell”, Journal of Power Sources, Vol. 188, pp. 319-322.
    2. H.-M. Chung, C.-M. Chen, C.-P. Lin, and C.-J. Chen, OCT 2009, “Microstructural Evolution of the Au-20 wt.% Sn Solder on the Cu Substrate During Reflow”, Journal of Alloys and Compounds, Vol. 485, pp. 219-224.
    3. C.-P. Lin and C.-M. Chen, JUN 2009, “Intermetallic compound formation and evolution in the solid-state Sn/immersion-Ag/Cu tri-layer interfacial reactions on a flexible polymer board”, Journal of Electronic Materials, Vol. 38, pp. 908-914.
    4. C.-M. Chen and Y.-J. Chen, JUL 2009, “Growth orientation of the tin whiskers on an electrodeposited Sn layer under three-point bending”, Materials Letters, Vol. 63, pp. 1517-1520.
    5. C.-M. Chen, Y.-M. Hung, and C.-H. Lin, MAY 2009, “Electromigration of Sn-8 wt.% Zn-3 wt.% Bi and Sn-9 wt.% Zn-1 wt.% Cu solders”, Journal of Alloys and Compounds, Vol. 475, pp. 238-244.
    6. C.-M. Chen, Y.-M. Hung, C.-P. Lin, and W.-C. Su, MAY 2009, “Effect of temperature on microstructural changes of the Sn-9 wt.% Zn lead-free solder stripe under current stressing”, Materials Chemistry and Physics, Vol. 115, pp. 367-370.
    7. Y.-J. Chen and C.-M. Chen, MAR 2009, “Mitigative tin whisker growth under mechanically applied tensile stress”, Journal of Electronic Materials, Vol. 38, pp. 415-419.
    8. C.-M. Chen, P.-Y. Shih, and Y.-W. Lin, JAN 2009, “Synthesis of nanostructured carbon materials on a tin thin film using phenol formaldehyde as the carbon source”, Journal of Electronic Materials, Vol. 38, pp. 193-199.
    9. C.-H. Chen, C.-P. Lin, and C.-M. Chen, JAN 2009, “Effect of Cu thickness on the evolution of the reaction products at the Sn-9 wt.% Zn solder/Cu interface during reflow”, Journal of Electronic Materials, Vol. 38, pp. 61-69.
  • Year 2008
    1. C.-M. Chen and P.-Y. Shih, 2008, “A peculiar composite structure of carbon nanofibers growing on a micro-sized tin whisker”, Journal of Materials Research, Vol. 23(10), pp. 2668-2673.
    2. C.-M. Chen, C.-H. Chen, and C.-P. Lin, and W.-C. Su, 2008, “Morphological evolution of reaction product at Sn-9 wt.% Zn/thin-film Cu interface”, Journal of Electronic Materials, Vol. 37(10), pp. 1605-1610.
    3. C.-M. Chen and C.-C. Huang, 2008, “Effects of silver doping on electromigration of eutectic SnBi solder”, Journal of Alloys and Compounds, Vol. 461, pp. 235-241.
    4. Y.-M. Hung and C.-M. Chen, 2008, “Electromigration of Sn-9 wt.% Zn solder”, Journal of Electronic Materials, Vol. 37, pp. 887-893.
    5. C.-M. Chen and C.-C. Huang, 2008, “Atomic migration in eutectic SnBi solder alloy due to current stressing”, Journal of Materials Research, Vol. 23, pp. 1051-1056.
  • Year 2007
    1. C.-M. Chen and C.-H. Chen, 2007, “Interfacial reactions between eutectic SnZn solder and bulk or thin-film Cu substrates”, Journal of Electronic Materials, Vol. 36(10), pp. 1363-1371.
    2. C.-M. Chen, C.-C. Huang, C.-N. Liao, and K.-M. Liou, 2007, “Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing”, Journal of Electronic Materials, Vol. 36, pp. 760-765.
    3. T.-C. Wei, C.-C. Wan, Y.-Y. Wang, C.-M. Chen, and H.-S. Shiu, 2007, “Immobilization of poly (N-vinyl-2-pyrrolidone)-capped platinum nano-clusters on indium-tin oxide glass and its application in dye-sensitized solar cells”, Journal of Physical Chemistry C, Vol. 111, pp. 4847-4853.
    4. C.-M. Chen, K.-Z. Wang, and K.-C. Chen, 2007, “Isothermal solid-state aging of Pb-5Sn solder bump on Ni/Cu/Ti under bump metallization”, Journal of Alloys and Compounds, Vol. 432, pp. 122-128.
    5. C.-M. Chen, L.-T. Chen, and Y.-S. Lin, 2007, “Electromigration-induced Bi segregation in eutectic SnBi solder joint”, Journal of Electronic Materials, Vol. 36(2), pp. 168-172.
  • Year 2006
    1. C.-M. Chen and H.-C. Lin, 2006, “Interfacial reactions and mechanical properties of ball-grid-array solder joints using Cu-cored solder balls”, Journal of Electronic Materials, Vol. 35, pp. 1937-1947.
    2. L.-T. Chen and C.-M. Chen, 2006, “Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization”, Journal of Materials Research, Vol. 21(4), pp. 962-969.
  • Year 2005
    1. K.-Z. Wang and C.-M. Chen, 2005, “Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with the Ti/Cu/Ni under bump metallization during reflow soldering”, Journal of Electronic Materials, Vol. 34(12), pp. 1543-1549.
  • Year 2003
    1. M.-Y. Du, C.-M. Chen, S.-W. Chen, 2003, “Effects upon interfacial reactions by electric currents of reversing directions”, Materials Chemistry and Physics, Vol. 82, pp. 818-825.
    2. C.-M. Chen and S.-W. Chen, 2003, “Electromigration effects upon the low-temperature Sn/Ni interfacial reactions”, Journal of Materials Research, Vol. 18(6), pp. 1293-1296.
    3. J.-I. Lee, S.-W. Chen, H.-Y. Chang and C.-M. Chen, 2003, “Reactive Wetting between Molten Sn-Bi and Ni Substrate”, Journal of Electronic Materials, Vol. 32(3), pp. 117-122.
    4. S.-W. Chen and C.-M. Chen, 2003, “Electromigration Effects upon Interfacial Reactions”, JOM, Vol. 55(2), pp. 62-67.
  • Year 2002
    1. C.-M. Chen and S.-W. Chen*, 2002, “Electromigration Effect upon the Sn/Ag and Sn/Ni Interfacial Reactions at Various Temperatures”, Acta Materialia, Vol. 50, pp. 2461-2469.
  • Year 2001
    1. C.-M. Chen and S.-W. Chen*, 2001, “Electromigration Effect upon the Sn-0.7wt%Cu/Ni and Sn-3.5wt%Ag/Ni Interfacial Reactions”, Journal of Applied Physics, Vol. 90(3), pp.1208-1214.
  • Year 2000
    1. C.-M. Chen and S.-W. Chen*, 2000, “Electromigration Effect upon the Zn/Ni and Bi/Ni Interfacial Reactions”, Journal of Electronic Materials, Vol. 29(10), pp. 1222-1228.
    2. S.-W. Chen, C.-S. Ho, C.-H. Lin and C.-M. Chen, 2000, “The 900℃ Isothermal Section of Ti-Ni-V Alloys”, Metallurgical and Materials Transactions A, Vol. 31A, pp. 1679-1682.
  • Year 1999
    1. C.-M. Chen and S.-W. Chen*, 1999, “Electric Current Effects on Sn/Ag Interfacial Reactions”, Journal of Electronic Materials, Vol. 28(7), pp. 902-906.
  • Year 1998
    1. S.-W. Chen, C.-C. Lin and C.-M. Chen, 1998, “Determination of the Melting and Solidification Characteristics of Solders Using Differential Scanning Calorimetry”, Metallurgical and Materials Transactions A, Vol. 29A, pp. 1965-1972.
    2. S.-W. Chen, C.-M. Chen, and W.-C. Liu, 1998, “Electric Current Effects upon the Sn/Cu and Sn/Ni Interfacial Reactions”, Journal of Electronic Materials, Vol. 27(11), pp. 1193-1198.
    3. W.-C. Liu, S.-W. Chen*, and C.-M. Chen, 1998, “The Al/Ni Interfacial Reactions under the Influence of Electric Current”, Journal of Electronic Materials, Vol. 27(1), pp. L5-L8.
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