Amazing Works.

陳志銘 教授 Chih-Ming Chen, Professor.

  • Professional Appointments
    • 2004.08~2007.07
    • Assistant Professor, Department of Chemical Engineering, National Chung Hsing University, Taichung, Taiwan
    • 2007.08~2011.01
    • Associate Professor, Department of Chemical Engineering, National Chung Hsing University, Taichung, Taiwan
    • 2011.02~2015.07
    • Professor, Department of Chemical Engineering, National Chung Hsing University, Taichung, Taiwan
    • 2015.08~now
    • Distinguished Professor, Department of Chemical Engineering, National Chung Hsing University, Taichung, Taiwan
  • Biography
    • Chih-Ming Chen received the B.S. and Ph.D. degrees in chemical engineering from National Tsing Hua University, Hsinchu, Taiwan, in 1997 and 2002, respectively. He joined the Department of Chemical Engineering with National Chung Hsing University, Taichung, Taiwan, as an Assistant Professor, where he is currently a Professor. He has authored and co-authored over 100 technical papers in international scientific journals. He also serves as an associate editor and editorial board member for several SCI journals. His current research interests include microelectronic packaging, LED packaging, and solar cells.
  • Publications
    • Year 2018
      1. Chih-Hsiang Huang, Yu-Wen Chen, and Chih-Ming Chen, 2018, "Chromatic Titanium Photoanode for Dye-Sensitized Solar Cells under Rear Illumination", ACS Applied Materials & Interfaces, Accepted for publication. (DOI: 10.1021/acsami.7b18351)
      2. Kamani Reddy, Yen-Chiao Chen, Chih-Chung Wu, Chia-Wei, Hsu, Ya-Ching Chang, Chih-Ming Chen, and Chen-Yu Yeh, 2018, "Co-sensitization of Structurally Simple Porphyrin and Anthracene-based Dye for Dye-Sensitized Solar Cells", ACS Applied Materials & Interfaces, Accepted for publication. (DOI: 10.1021/acsami.7b12960)
      3. Gita Novian Hermana, Tzu-Ting Huang, Chih-Ming Chen, Chin-Hung Lin, Satoshi Iikubo, and Yee-Wen Yen, 2018 February, “Phase Equilibria of the Cu-Ni-Zr Ternary Systems at 800 °C and Thermodynamic Assessment and Metallic Glass Region Prediction for the Cu-Ni-Zr Ternary System”, Journal of Non-Crystalline Solids, Vol. 481: 1, pp. 612-621.
      4. Yu-Chen Tseng, Hsuan Lee, Nga Yu Hau, Shien-Ping Feng, and Chih-Ming Chen, 2018 January, “Electrodeposition of Ni on Bi2Te3 and Interfacial reaction between Sn and Ni-coated Bi2Te3”, Journal of Electronic Materials, Vol. 47 (1), pp. 27-34. (DOI: 10.1007/s11664-017-5777-1)
    • Year 2017
      1. Yeng-Fong Shih, Man-Yun Chou, Wen-Chuan Chang, Hong-Yuan Lian, and Chih-Ming Chen, 2017 November, “Completely Biodegradable Composites Reinforced by the Cellulose Nanofibers of Pineapple Leaves Modified by Eco-friendly Methods”, Journal of Polymer Research, Vol. 24: 209, pp. 1-12.
      2. Jyun-Wei Chen, Chih-Ming Chen, and Cheng-Chung Chang, 2017 September, “A fluorescent pH probe for acidic organelle in living cells”, Organic & Biomolecular Chemistry, Vol. 15, pp. 7936-7943.
      3. Pei-Yu Wu, Ching-Hsuan Lin, and Chih-Ming Chen, 2017 May, “Study of Surface Metallization of Polyimide Film and Interfacial Characterization”, Metals, Vol. 7, pp. 189 (12 pages).
      4. Hsuan Lee, Tai-Yi Yu, Hsi-Kuei Cheng, Kuo-Chio Liu, Po-Fan Chan, Wei-Ping Dow*, and Chih-Ming Chen, 2017 July, “Impurity Incorporation in the Cu Electrodeposit and Its Effects on the Microstructural Evolution of the Sn/Cu Solder Joints”, Journal of The Electrochemical Society, Vol. 164, pp. D457-D462.
      5. Yu-Jie Lin, Jyun-Wei Chen, Po-Tsung Hsiao, Yung-Liang Tung, Cheng-Chung Chang, and Chih-Ming Chen, 2017 April, “Efficiency Improvement of Dye-sensitized Solar Cells by In-situ Fluorescence Resonance Energy Transfer”, Journal of Materials Chemistry A, Vol. 5, pp. 9081-9089. (DOI: 10.1039/C7TA00638A).
      6. Chia-Yuan Chen, Zih-Hong Jian, Shih-Han Huang, Kun-Mu Lee, Ming-Hsuan Kao, Chang-Hong Shen, Jia-Min Shieh, Chin-Li Wang, Chiung-Wen Chang, Bo-Zhi Lin, Ching-Yao Lin, Ting-Kuang Chang, Yun Chi, Cheng-Yu Chi, Wei-Ting Wang, Yian Tai, Ming-De Lu, Yung-Liang Tung, Po-Ting Chou, Wen-Ti Wu, Tahsin J. Chow, Peter Chen, Xiang-Hao Luo, Yuh-Lang Lee, Chih-Chung Wu, Chih-Ming Chen, Chen-Yu Yeh, Miao-Syuan Fan, Jia-De Peng, Kuo-Chuan Ho, Yu-Nan Liu, Hsiao-Yi Lee, Chien-Yu Chen, Hao-Wu Lin, Chia-Te Yen, Yu-Ching Huang, Cheng-Si Tsao, Yu-Chien Ting, Tzu-Chien Wei, and Chun-Guey Wu, 2017 April, “Performance Characterization of Dye-Sensitized Photovoltaics Under Indoor Lighting”, Journal of Physical Chemistry Letters, Vol. 8 (8), pp. 1824-1830.
      7. Yu-Chen Tseng, Hsuan Lee, Shan-Chen Tsai, Yee-Wen Yen, and Chih-Ming Chen, 2017 June, “Suppression Effect of Ni Grain Size on the Ni3Sn4 Growth at the Sn/Ni Interface”, Materials Characterization, Vol. 128, pp. 232-237. (doi.org/10.1016/j.matchar.2017.04.013).
      8. Chih-Fan Lin, Nga Yu Hau, Yu-Ting Huang, Ya-Huei Chang, Shien-Ping Feng, Chih-Ming Chen, 2017 June, “Synergetic effect of Bi2Te3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi2Te3 joints”, Journal of Alloys and Compounds, Vol. 708, pp. 220-230.
    • Year 2016
      1. Tai-Yi Yu, Hsuan Lee, Hsuan-Ling Hsu, Wei-Ping Dow, Hsi-Kuei Cheng, Kuo-Chio Liu, and Chih-Ming Chen, October 2016, “Effects of Cu electroplating formulas on the interfacial microstructures of Sn/Cu joints”, Journal of The Electrochemical Society, Vol. 163, pp. D734-741.
      2. Tzu-Ting Huang, Shih-Wei Lin, Chih-Ming Chen, Pei-Yu Chen, and Yee-Wen Yen, December 2016, “Phase Equilibria of the Fe-Ni-Sn Ternary System at 270 oC”, Journal of Electronic Materials, Vol. 45, pp. 6208-6213.
      3. Tzu-Hao Wang, Hsuan Lee, Chih-Ming Chen, Ming-Guan Chen, Chi-Chang Hu, Yu-Jie Chen, and Ray-Hua Horng, August 2016, “Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material”, Microelectronics Reliability, Vol. 63, pp. 68-75.
      4. Ting-Chien Liu, Chih-Chung Wu, Chih-Hsiang Huang, and Chih-Ming Chen, December 2016, “Effects of Ethyl Cellulose on Performance of Titania Photoanode for Dye-sensitized Solar Cells”, Journal of Electronic Materials, Vol. 45, pp. 6192-6199.
      5. Kuei-Chang Lai, Pei-Yu Wu, Chih-Ming Chen, Tzu-Chien Wei, Chung-Han Wu, and Shien-Ping Feng, October 2016, “Interfacial characterizations of a nickel-phosphorus layer electrolessly deposited on a silane-compound-modified silicon wafer under thermal annealing”, Journal of Electronic Materials, Vol. 45, pp. 4813-4822.
      6. H.-K. Cheng, Y.-J. Lin, C.-M. Chen, K.-C. Liu, Y.-L. Wang, and T.-F. Liu, August 2016, “Microstructural evolution of Cu/solder/Cu pillar-type structures with different diffusion barriers”, Metallurgical and Materials Transactions A, Vol. 47, pp. 3971-3980.
      7. H.-M. Hsiao, Y.-W. Chang, C.-M. Chen, P.-Y. Chen, Y.-P. Wu, Y.-W. Yen, July 2016, “Phase equilibria in the Au-Bi-Sn ternary system at temperatures of 80, 125, and 150 oC”, International Journal of Materials Research, Vol. 107, pp. 615-623.
      8. 20. H.-T. Chan, C.-F. Lin, Y.-W. Yen, and C.-M. Chen, May 2016, “Effects of current stressing on the p-Bi2Te3/Sn interfacial reactions”, Journal of Alloys and Compounds, Vol. 668, pp. 91-96.
    • Year 2015
      1. L.-C. Cheng, C.-M. Chen, M.-G. Chen, C.-C. Hu, H.-Y. Jiang, R.-H. Horng and D.-S. Wuu, 2015 August, “A high-temperature die-bonding structure fabricated at low temperature for light-emitting diodes”, IEEE Electron Device Letters, Vol. 36, pp. 835-837.
      2. S. Ye, J.-D. Hwang, and C.-M. Chen, 2015 June, “Strong anisotropic effects of p-type Bi2Te3 element on the Bi2Te3/Sn interfacial reactions”, Metallurgical and Materials Transactions A, Vol. 46, pp. 2372-2375.
      3. H.-K. Cheng, Y.-J. Lin, H.-C. Chang, K.-C. Liu, Y.-L. Wang, T.-F. Liu, and C.-M. Chen, 2015 May, “Unusual morphological evolution of the Cu pillar/solder micro-joints during high-temperature annealing”, Metallurgical and Materials Transactions A, Vol. 46, pp. 1834-1837.
      4. T.-C. Wei, T.-C. Pan, C.-M. Chen, K.-C. Lai, and C.-H. Wu, 2015 May, “Annealing-free adhesive electroless deposition of nickel/phosphorous layer on silane-compound modified Si wafer”, Electrochemistry Communications, Vol. 54, pp. 6-9.
      5. Y.-W. Yen, C.-W. Chiu, C.-M. Chen, M.-T. Lai, and J.-Y. Dai, 2015 March, “Interfacial Reactions in Sn/Ni-xW Couples”, Journal of Electronic Materials, Vol. 44, pp. 909-915.
      6. C.-C. Chou, K.-Y. Tsao, C.-C. Wu, H. Yang, and C.-M. Chen, 2015 February, “Improved power conversion efficiency for dye-sensitized solar cells using a subwavelength-structured antireflective coating”, Applied Surface Science, Vol. 328, pp. 198-204.
      7. H.-K. Cheng, C.-W. Huang, H. Lee, Y.-L. Wang, T.-F. Liu, and C.-M. Chen, 2015 February, “Interfacial Reactions between Cu and SnAgCu solder doped with minor Ni”, Journal of Alloys and Compounds, Vol. 622, pp. 529-534.
      8. T.-K. Yang, C.-F. Lin, and C.-M. Chen, 2015 January, “Interfacial Reactions between Cu-Ag alloy substrates and Sn”, Journal of Electronic Materials, Vol. 44, pp. 511-517.
      9. Y.-J. Lin, C.-C. Chang, S.-J. Cherng, J.-W. Chen, and C.-M. Chen, 2015 January, “Manipulation of light harvesting for efficient dye-sensitized solar cell by doping an ultraviolet light-capturing fluorophore”, Progress in Photovoltaics: Research and Applications, Vol. 23, pp. 106-111.
    • Year 2014
      1. C.-F. Lin, C.-M. Chen, W.-P. Dow, H.-H. Liu, H.-C. Tien, S.-F. Lee, and W.-M. Chen, 2014 October, "Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 4, pp. 1739-1744.
      2. J.-Y. Wu, H. Lee, C.-H. Wu, C.-F. Lin, W.-P. Dow, and C.-M. Chen, 2014 October, "Effects of Electroplating Additives on the Interfacial Reactions between Sn and Cu Electroplated Layers", Journal of The Electrochemical Society, Vol. 161, pp. D522-D527.
      3. F.-C. Hsu, Y.-C. Cheng, Y.-T. Wang, M.-T. Lin, C.-M. Chen, 2014 June-July, "Planar copper-tin intermetallic film formation on strained substrates", Microelectronics Reliability, Vol. 54, pp. 1378-1383.
      4. Y.-H. Chang, Y.-T. Huang, M.-K. Lo, C.-F. Lin, C.-M. Chen, S.-P. Feng, 2014 June, "Electrochemical Fabrication of Transparent Nickel Hydroxide Nanostructures with Tunable Superhydrophobicity/Superhyrophilicity for 2D Microchannels Application", Journal of Materials Chemistry A, Vol. 2, pp. 1985-1990.
      5. P.-K. Chuang, Y.-J. Lin, C.-M. Chen, and C.-C. Chang, 2014 June, "Improved power conversion efficiency of dye-sensitized solar cells by fluorophore-assisted spectrum down-conversion", Journal of The Electrochemical Society, Vol. 161, pp. H404-H409.
      6. C.-P. Lin, C.-M. Chen and Y.-W. Yen, 2014 April, "Enhanced growth of the Cu6Sn5 phase in the Sn/Ag/Cu and Sn/Cu multilayers subjected to applied strain", Journal of Alloys and Compounds, Vol. 591, pp. 297-303.
      7. F. Xie, S.-J. Cherng, S. Lu, Y.-H. Chang, W. Sha, S.-P. Feng, C.-M. Chen, W. Choy, 2014 March, "The Functions of Self-assembled Ultrafine TiO2 Nanocrystals for High Efficient Dye-Sensitized Solar Cells", ACS Applied Materials & Interfaces, Vol. 6, pp. 5367-5373.
      8. H.-K. Cheng, S.-P. Feng, Y.-J. Lai, K.-C. Liu, Y.-L. Wang, T.-F. Liu, and C.-M. Chen, 2014 March, "Effect of Polyimide Baking on Bump Resistance in Flip-Chip Solder Joints", Microelectronics Reliability, Vol. 54, pp. 629-632.
      9. H.-F. Ting, C.-M. Chen, F.-H. Lu, S.-Y. Suen, 2014 March, "Adsorption and photodegradation of methylene blue using a bulk Ti material with porous titania layer prepared by chemical oxidation", Journal of the Taiwan Institute of Chemical Engineers, Vol. 45, pp. 617-624.
      10. Y.-W. Yen, R.-S. Syu, C.-M. Chen, C.-C. Jao, G.-D. Chen, 2014 January, "Interfacial Reactions of Sn-58Bi and Sn-0.7Cu Lead-free Solders with Alloy42 Substrate Microelectronics Reliability", Microelectronics Reliability, Vol. 54, pp. 233-238.
      11. J.-Y. Wang, C.-M. Chen, and Y.-W. Yen, 2014 January, "Interfacial reactions of high-Bi alloys on various substrates", Journal of Electronic Materials, Vol. 43, pp. 155-165.
    • Year 2013
      1. C.-Y. Hsu, S.-J. Cherng, Y.-J. Lin and C.-M. Chen, 2013 November, “A Compact Nano-TiO2 Underlayer for Efficient Dye-sensitized Solar Cell”, IEEE Electron Device Letters, Vol. 34, pp. 1415-1417.
      2. Y.-T. Huang, Y.-Y. Zhan, S.-J. Cherng, C.-M. Chen, S.-P. Feng, T.-C. Wei, 2013 September, "Surface metallization of polyimide as a photoanode substrate for rear-illuminated dye-sensitized solar cells", Journal of The Electrochemical Society, Vol. 160, H581-H586.
      3. Y.-T. Huang, S.-P. Feng, and C.-M. Chen, 2013 June, “Nickel Substrate covered with a Sn-based Protection Bi-layer as a Photoanode Substrate for Dye-sensitized Solar Cells”, Electrochimica Acta, Vol. 99, pp. 230-237.
      4. T.-Y. Tsai, C.-M. Chen, S.-J. Cherng, and S.-Y. Suen, 2013 March, “An efficient titanium-based photoanode for dye-sensitized solar cell under back-side illumination”, Progress in Photovoltaics: Research and Applications, Vol. 21, pp. 226-231.
      5. C.-P. Lin and C.-M. Chen, 2013 January, “The cross-interactions in the Ni/Sn/Cu diffusion couples with an electroless palladium surface finish”, Journal of Alloys and Compounds, Vol. 547, pp. 37-42.
      6. J.-Y. Wu, C.-M. Chen, R.-H. Horng, and D.-S. Wuu, 2013 January, “An efficient metal-core printed-circuit board with a copper-filled through (blind) hole for light-emitting diodes”, IEEE Electron Device Letters, Vol. 34, pp. 105-107.
      7. P.-H. Lee, C.-P. Lin, and C.-M. Chen, 2013 January, “Retardation of the Cu5Zn8 phase fracture and improvement of shear strength of the Sn-9 wt.% Zn/Cu interface by inserting an electroless Palladium layer”, Metallurgical and Materials Transactions A, Vol. 44A, pp. 125-130.
    • Year 2012
      1. T.-C. Wei, S.-P. Feng, Y.-H. Chang, S.-J. Cherng, Y.-J. Lin, C.-M. Chen, H.-H. Chen, 2012 December, “Fabrication and Characterization of Interconnected Grid-type Dye-Sensitized Solar Modules”, International Journal of Electrochemical Science, Vol. 7, pp. 11904-11916.
      2. J.-Y. Wang, C.-F. Lin, and C.-M. Chen, 2012 December, “Interfacial reactions and mechanical properties of the Bi-x wt.% Sn/Cu joints (x= 2, 5, and 10)”, Journal of Electronic Materials, Vol. 41, pp. 3303-3308.
      3. H.-A. Pan, C.-P. Lin, and C.-M. Chen, 2012 September, “Interfacial reaction of molten Sn on a strained Cu electroplated layer”, Journal of Electronic Materials, Vol. 41, pp. 2470-2477.
      4. C.-F. Lin, S.-H. Lee, and C.-M. Chen, 2012 August, “Effect of Sn grain orientation on the Cu6Sn5 formation in a Sn-based solder under current stressing”, Metallurgical and Materials Transactions A, Vol. 43A, pp. 2571-2573.
      5. B.-H. Liou, C.-M. Chen, R.-H. Horng, Y.-C. Chiang, and D.-S. Wuu, 2012 May, ”Improvement of thermal management of high-power GaN-based light-emitting diodes”, Microelectronics Reliability, Vol. 52, pp. 861-865.
      6. C.-P. Lin and C.-M. Chen, 2012 February, “Solid-state interfacial reactions at the solder joints employing Ni/Pd/Au and Ni/Au as the surface finish metallizations”, Microelectronics Reliability, Vol. 52, pp. 385-390.
    • Year 2011
      1. W.-K. Liao, C.-M. Chen, M.-T. Lin, C.-H. Wang, 2011 October, “Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains”, Scripta Materialia, Vol. 65, pp. 691-694.
      2. S.-H. Lee and C.-M. Chen, 2011 September, “Electromigration in a Sn-3wt.%Ag-0.5wt.%Cu-3wt.%Bi solder stripe between two Cu electrodes under current stressing”, Journal of Electronic Materials, Vol. 40, pp. 1943-1949.
      3. S.-J. Cherng, C.-M. Chen, W.-P. Dow, C.-H. Lin, and S.-W. Chen, 2011 July, “Chemical deposition of Ni/Pt bi-layer on polyimide film as flexible counterelectrodes for dye-sensitized solar cells”, Electrochemical and Solid State Letters, Vol. 14, P13-P15.
      4. Y.-T. Huang, Y.-W. Lin, and C.-M. Chen, 2011 May, “Characterization of carbon nanomaterials synthesized from thermal decomposition of paper phenolic board”, Materials Chemistry and Physics, Vol. 127, pp. 397-404.
      5. J.-L. Lan, C.-C. Wan, T.-C. Wei, W.-C. Hsu, C. Peng, Y.-H. Chang, and C.-M. Chen, 2011 May, “Improvement of Photovoltaic Performance of Dye-Sensitized Solar Cell by Post Heat Treatment of Polymer-Capped Nano-Platinum Counterelectrode”, International Journal of Electrochemical Science, Vol. 6, pp. 1230-1236.
      6. J.-Y. Wang, C.-F. Lin, and C.-M. Chen, 2011 April, “Retarding the Cu5Zn8 phase fracture at the Sn-9 wt.% Zn/Cu interface”, Scripta Materialia, Vol. 64, pp. 633-636.
      7. C.-M. Chen, Y.-C. Hsu, and S.-J. Cherng, 2011 January, “Effects of annealing conditions on the properties of TiO2/ITO-based photoanode and the photovoltaic performance of dye-sensitized solar cells”, Journal of Alloys and Compounds, Vol. 509, pp. 872-877.
    • Year 2010
      1. C.-J. Chen, C.-M. Chen, R.-H. Horng, D.-S. Wuu, and J.-S. Hong, 2010 December, “Thermal management and interfacial properties in high-power GaN-based light-emitting diodes employing diamond-added Sn-3wt.%Ag-0.5wt.%Cu solder as die attach materials”, Journal of Electronic Materials, Vol. 39, pp. 2618-2626.
      2. C.-M. Chen, C.-H. Chen, S.-J. Cherng, and T.-C. Wei, 2010 November, “Electroless deposition of platinum on indium tin oxide glass as the counterelectrode for dye-sensitized solar cells”, Materials Chemistry and Physics, Vol. 124, pp. 173-178.
      3. J.-S. Hong, R.-H. Horng*, Y.-L. Tsai, D.-S. Wuu, C.-M. Chen, and C.-J. Chen, 2010 September, “Optimized Thermal Management from Chip to Heat Sink for High-Power GaN-Based Light-Emitting Diodes”, IEEE Transactions on Electron Devices, Vol. 57, pp. 2203-2207.
      4. S.-J. Cherng, Y.-C. Hsu, and C.-M. Chen, 2010 September, “Mitigation of Solvent Evaporation in Dye-Sensitized Solar Cells Based on Liquid Electrolyte by Introducing Regular-fencing-patterned Polymer Films”, Journal of the Chinese Institute of Engineers, Vol. 33, pp. 791-797.
      5. C.-P. Lin, C.-M. Chen, C.-H. Lin, and W.-C. Su, 2010 July, “Interfacial reactions of Sn/Ag/Cu tri-layer on a deformed polyimide substrate”, Journal of Alloys and Compounds, Vol. 502, pp. L17-L19.
      6. Y.-W. Lin, P.-Y. Shih, and C.-M. Chen, 2010 March, “A current-induced localized heating technique for fabrication of carbon nanomaterials”, Journal of Alloys and Compounds, Vol. 492, pp. 521-524.
      7. C.-M. Chen, C.-H. Chen, and T.-C. Wei, 2010 February, “Chemical deposition of platinum on metallic sheets as counterelectrodes for dye-sensitized solar cells”, Electrochimica Acta, Vol. 55, pp. 1687-1695.
    • Year 2009
      1. C.-M. Chen, H.-S. Shiu, S.-J. Cherng, and T.-C. Wei, MAR 2009, “Preparation of polymer film of micro-porous or island-like structure and its application in dye-sensitized solar cell”, Journal of Power Sources, Vol. 188, pp. 319-322.
      2. H.-M. Chung, C.-M. Chen, C.-P. Lin, and C.-J. Chen, OCT 2009, “Microstructural Evolution of the Au-20 wt.% Sn Solder on the Cu Substrate During Reflow”, Journal of Alloys and Compounds, Vol. 485, pp. 219-224.
      3. C.-P. Lin and C.-M. Chen, JUN 2009, “Intermetallic compound formation and evolution in the solid-state Sn/immersion-Ag/Cu tri-layer interfacial reactions on a flexible polymer board”, Journal of Electronic Materials, Vol. 38, pp. 908-914.
      4. C.-M. Chen and Y.-J. Chen, JUL 2009, “Growth orientation of the tin whiskers on an electrodeposited Sn layer under three-point bending”, Materials Letters, Vol. 63, pp. 1517-1520.
      5. C.-M. Chen, Y.-M. Hung, and C.-H. Lin, MAY 2009, “Electromigration of Sn-8 wt.% Zn-3 wt.% Bi and Sn-9 wt.% Zn-1 wt.% Cu solders”, Journal of Alloys and Compounds, Vol. 475, pp. 238-244.
      6. C.-M. Chen, Y.-M. Hung, C.-P. Lin, and W.-C. Su, MAY 2009, “Effect of temperature on microstructural changes of the Sn-9 wt.% Zn lead-free solder stripe under current stressing”, Materials Chemistry and Physics, Vol. 115, pp. 367-370.
      7. Y.-J. Chen and C.-M. Chen, MAR 2009, “Mitigative tin whisker growth under mechanically applied tensile stress”, Journal of Electronic Materials, Vol. 38, pp. 415-419.
      8. C.-M. Chen, P.-Y. Shih, and Y.-W. Lin, JAN 2009, “Synthesis of nanostructured carbon materials on a tin thin film using phenol formaldehyde as the carbon source”, Journal of Electronic Materials, Vol. 38, pp. 193-199.
      9. C.-H. Chen, C.-P. Lin, and C.-M. Chen, JAN 2009, “Effect of Cu thickness on the evolution of the reaction products at the Sn-9 wt.% Zn solder/Cu interface during reflow”, Journal of Electronic Materials, Vol. 38, pp. 61-69.
    • Year 2008
      1. C.-M. Chen and P.-Y. Shih, 2008, “A peculiar composite structure of carbon nanofibers growing on a micro-sized tin whisker”, Journal of Materials Research, Vol. 23(10), pp. 2668-2673.
      2. C.-M. Chen, C.-H. Chen, and C.-P. Lin, and W.-C. Su, 2008, “Morphological evolution of reaction product at Sn-9 wt.% Zn/thin-film Cu interface”, Journal of Electronic Materials, Vol. 37(10), pp. 1605-1610.
      3. C.-M. Chen and C.-C. Huang, 2008, “Effects of silver doping on electromigration of eutectic SnBi solder”, Journal of Alloys and Compounds, Vol. 461, pp. 235-241.
      4. Y.-M. Hung and C.-M. Chen, 2008, “Electromigration of Sn-9 wt.% Zn solder”, Journal of Electronic Materials, Vol. 37, pp. 887-893.
      5. C.-M. Chen and C.-C. Huang, 2008, “Atomic migration in eutectic SnBi solder alloy due to current stressing”, Journal of Materials Research, Vol. 23, pp. 1051-1056.
    • Year 2007
      1. C.-M. Chen and C.-H. Chen, 2007, “Interfacial reactions between eutectic SnZn solder and bulk or thin-film Cu substrates”, Journal of Electronic Materials, Vol. 36(10), pp. 1363-1371.
      2. C.-M. Chen, C.-C. Huang, C.-N. Liao, and K.-M. Liou, 2007, “Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing”, Journal of Electronic Materials, Vol. 36, pp. 760-765.
      3. T.-C. Wei, C.-C. Wan, Y.-Y. Wang, C.-M. Chen, and H.-S. Shiu, 2007, “Immobilization of poly (N-vinyl-2-pyrrolidone)-capped platinum nano-clusters on indium-tin oxide glass and its application in dye-sensitized solar cells”, Journal of Physical Chemistry C, Vol. 111, pp. 4847-4853.
      4. C.-M. Chen, K.-Z. Wang, and K.-C. Chen, 2007, “Isothermal solid-state aging of Pb-5Sn solder bump on Ni/Cu/Ti under bump metallization”, Journal of Alloys and Compounds, Vol. 432, pp. 122-128.
      5. C.-M. Chen, L.-T. Chen, and Y.-S. Lin, 2007, “Electromigration-induced Bi segregation in eutectic SnBi solder joint”, Journal of Electronic Materials, Vol. 36(2), pp. 168-172.
    • Year 2006
      1. C.-M. Chen and H.-C. Lin, 2006, “Interfacial reactions and mechanical properties of ball-grid-array solder joints using Cu-cored solder balls”, Journal of Electronic Materials, Vol. 35, pp. 1937-1947.
      2. L.-T. Chen and C.-M. Chen, 2006, “Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization”, Journal of Materials Research, Vol. 21(4), pp. 962-969.
    • Year 2005
      1. K.-Z. Wang and C.-M. Chen, 2005, “Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with the Ti/Cu/Ni under bump metallization during reflow soldering”, Journal of Electronic Materials, Vol. 34(12), pp. 1543-1549.
    • Year 2003
      1. M.-Y. Du, C.-M. Chen, S.-W. Chen, 2003, “Effects upon interfacial reactions by electric currents of reversing directions”, Materials Chemistry and Physics, Vol. 82, pp. 818-825.
      2. C.-M. Chen and S.-W. Chen, 2003, “Electromigration effects upon the low-temperature Sn/Ni interfacial reactions”, Journal of Materials Research, Vol. 18(6), pp. 1293-1296.
      3. J.-I. Lee, S.-W. Chen, H.-Y. Chang and C.-M. Chen, 2003, “Reactive Wetting between Molten Sn-Bi and Ni Substrate”, Journal of Electronic Materials, Vol. 32(3), pp. 117-122.
      4. S.-W. Chen and C.-M. Chen, 2003, “Electromigration Effects upon Interfacial Reactions”, JOM, Vol. 55(2), pp. 62-67.
    • Year 2002
      1. C.-M. Chen and S.-W. Chen*, 2002, “Electromigration Effect upon the Sn/Ag and Sn/Ni Interfacial Reactions at Various Temperatures”, Acta Materialia, Vol. 50, pp. 2461-2469.
    • Year 2001
      1. C.-M. Chen and S.-W. Chen*, 2001, “Electromigration Effect upon the Sn-0.7wt%Cu/Ni and Sn-3.5wt%Ag/Ni Interfacial Reactions”, Journal of Applied Physics, Vol. 90(3), pp.1208-1214.
    • Year 2000
      1. C.-M. Chen and S.-W. Chen*, 2000, “Electromigration Effect upon the Zn/Ni and Bi/Ni Interfacial Reactions”, Journal of Electronic Materials, Vol. 29(10), pp. 1222-1228.
      2. S.-W. Chen, C.-S. Ho, C.-H. Lin and C.-M. Chen, 2000, “The 900℃ Isothermal Section of Ti-Ni-V Alloys”, Metallurgical and Materials Transactions A, Vol. 31A, pp. 1679-1682.
    • Year 1999
      1. C.-M. Chen and S.-W. Chen*, 1999, “Electric Current Effects on Sn/Ag Interfacial Reactions”, Journal of Electronic Materials, Vol. 28(7), pp. 902-906.
    • Year 1998
      1. S.-W. Chen, C.-C. Lin and C.-M. Chen, 1998, “Determination of the Melting and Solidification Characteristics of Solders Using Differential Scanning Calorimetry”, Metallurgical and Materials Transactions A, Vol. 29A, pp. 1965-1972.
      2. S.-W. Chen, C.-M. Chen, and W.-C. Liu, 1998, “Electric Current Effects upon the Sn/Cu and Sn/Ni Interfacial Reactions”, Journal of Electronic Materials, Vol. 27(11), pp. 1193-1198.
      3. W.-C. Liu, S.-W. Chen*, and C.-M. Chen, 1998, “The Al/Ni Interfacial Reactions under the Influence of Electric Current”, Journal of Electronic Materials, Vol. 27(1), pp. L5-L8.
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