Amazing Works.

陳志銘 教授 Chih-Ming Chen, Professor.

國立清華大學化學工程學系 學士 (1997)

國立清華大學化學工程學系 博士 (2002)

國立中興大學化學工程學系 助理教授 (2004/8-2007/7)

國立中興大學化學工程學系 副教授 (2007/8-2011/1)

國立中興大學化學工程學系 教授 (2011/2-至今)

  • A. 期刊論文
  • 2014 年
  • 1. Y.-J. Lin, C.-C. Chang*, S.-J. Cherng, J.-W. Chen, and C.-M. Chen*, 2014, “Manipulation of light harvesting for efficient dye-sensitized solar cell by doping an ultraviolet light-capturing fluorophore”, Progress in Photovoltaics: Research and Applications, accepted for publication. (SCI, IF: 9.696, Ranking: 4/82 in ENERGY & FUELS)
  • 2. C.-F. Lin, C.-M. Chen*, W.-P. Dow, H.-H. Liu, H.-C. Tien, S.-F. Lee, and W.-M. Chen, 2014, “Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints”, IEEE Transactions on Components, Packaging and Manufacturing Technology, accepted for publication. (SCI, IF: 1.236, Ranking: 121/247 in ENGINEERING, ELECTRICAL & ELECTRONIC)
  • 3. J.-Y. Wu, H. Lee, C.-H. Wu, C.-F. Lin, W.-P. Dow*, and C.-M. Chen*, October 2014, “Effects of Electroplating Additives on the Interfacial Reactions between Sn and Cu Electroplated Layers”, Journal of The Electrochemical Society, Vol. 161, pp. D522-D527. (SCI, IF: 2.859, Ranking: 1/18 in MATERIALS SCIENCE, COATINGS & FILMS)
  • 4. F.-C. Hsu, Y.-C. Cheng, Y.-T. Wang, M.-T. Lin*, C.-M. Chen, 2014, “Planar copper-tin intermetallic film formation on strained substrates”, Microelectronics Reliability, Vol. 54, pp. 1378-1383. (SCI, IF: 1.214, Ranking: 124/247 in ENGINEERING, ELECTRICAL & ELECTRONIC)
  • 5. F. Xie, S.-J. Cherng, S. Lu, Y.-H. Chang, W. Sha, S.-P. Feng, C.-M. Chen*, W. Choy*, March 2014, “The Functions of Self-assembled Ultrafine TiO2 Nanocrystals for High Efficient Dye-Sensitized Solar Cells”, ACS Applied Materials & Interfaces, Vol. 6, pp. 5367-5373. (SCI, IF: 5.9, Ranking: 26/251 in MATERIALS SCIENCE, MULTIDISCIPLINARY)
  • 6. P.-K. Chuang, Y.-J. Lin, C.-M. Chen*, and C.-C. Chang*, June 2014, “Improved power conversion efficiency of dye-sensitized solar cells by fluorophore-assisted spectrum down-conversion”, Journal of The Electrochemical Society, Vol. 161, pp. H404-H409. (SCI, IF: 2.859, Ranking: 1/18 in MATERIALS SCIENCE, COATINGS & FILMS)
  • 7. J.-Y. Wang, C.-M. Chen*, and Y.-W. Yen, Jan 2014, "Interfacial reactions of high-Bi alloys on various substrates", Journal of Electronic Materials, Vol. 43, pp. 155-165. (SCI, IF: 1.675, Ranking: 83/247 in ENGINEERING, ELECTRICAL & ELECTRONIC)
  • 8. H.-K. Cheng, S.-P. Feng, Y.-J. Lai, K.-C. Liu, Y.-L. Wang*, T.-F. Liu*, and C.-M. Chen*, March 2014, “Effect of Polyimide Baking on Bump Resistance in Flip-Chip Solder Joints”, Microelectronics Reliability, Vol. 54, pp. 629-632. (SCI, IF: 1.214, Ranking: 124/247 in ENGINEERING, ELECTRICAL & ELECTRONIC)
  • 9. C.-P. Lin, C.-M. Chen* and Y.-W. Yen, April 2014, “Enhanced growth of the Cu6Sn5 phase in the Sn/Ag/Cu and Sn/Cu multilayers subjected to applied strain”, Journal of Alloys and Compounds, Vol. 591, pp. 297-303. (SCI, IF: 2.726, Ranking: 5/75 in METALLURGY & METALLURGICAL ENGINEERING)
  • 10. Y.-W. Yen*, R.-S. Syu, C.-M. Chen, C.-C. Jao, G.-D. Chen, Jan 2014, “Interfacial Reactions of Sn-58Bi and Sn-0.7Cu Lead-free Solders with Alloy42 Substrate Microelectronics Reliability”, Microelectronics Reliability, Vol. 54, pp. 233-238. (SCI, IF: 1.214, Ranking: 124/247 in ENGINEERING, ELECTRICAL & ELECTRONIC)
  • 11. H.-F. Ting, C.-M. Chen, F.-H. Lu, S.-Y. Suen*, March 2014, “Adsorption and photodegradation of methylene blue using a bulk Ti material with porous titania layer prepared by chemical oxidation”, Journal of the Taiwan Institute of Chemical Engineers, Vol. 45, pp. 617-624. (SCI, IF: 2.637, Ranking: 23/133 in ENGINEERING, CHEMICAL)
  • 12. Y.-H. Chang, Y.-T. Huang, M.-K. Lo, C.-F. Lin, C.-M. Chen, S.-P. Feng*, June 2014, “Electrochemical Fabrication of Transparent Nickel Hydroxide Nanostructures with Tunable Superhydrophobicity/Superhyrophilicity for 2D Microchannels Application”, Journal of Materials Chemistry A, Vol. 2, pp. 1985-1990. (A new journal isolated from Journal of Materials Chemistry, SCI, IF: 6.626, Ranking: 22/251 in MATERIALS SCIENCE, MULTIDISCIPLINARY)
  • 2013 年
  • 13. T.-Y. Tsai, C.-M. Chen*, S.-J. Cherng, and S.-Y. Suen, MAR 2013, “An efficient titanium-based photoanode for dye-sensitized solar cell under back-side illumination”, Progress in Photovoltaics: Research and Applications, Vol. 21, pp. 226-231. (SCI, IF: 9.696, Ranking: 4/82 in ENERGY & FUELS)
  • 14. Y.-T. Huang, S.-P. Feng, and C.-M. Chen*, JUN 2013, “Nickel Substrate covered with a Sn-based Protection Bi-layer as a Photoanode Substrate for Dye-sensitized Solar Cells”, Electrochimica Acta, Vol. 99, pp. 230-237. (SCI, IF: 4.086, Ranking: 4/27 in ELECTROCHEMISTRY)
  • 15. C.-P. Lin and C.-M. Chen*, JAN 2013, “The cross-interactions in the Ni/Sn/Cu diffusion couples with an electroless palladium surface finish”, Journal of Alloys and Compounds, Vol. 547, pp. 37-42. (SCI, IF: 2.726, Ranking: 5/75 in METALLURGY & METALLURGICAL ENGINEERING)
  • 16. J.-Y. Wu, C.-M. Chen*, R.-H. Horng, and D.-S. Wuu, JAN 2013, “An efficient metal-core printed-circuit board with a copper-filled through (blind) hole for light-emitting diodes”, IEEE Electron Device Letters, Vol. 34, pp. 105-107. (SCI, IF: 3.023, Ranking: 29/247 in ENGINEERING, ELECTRICAL & ELECTRONIC)
  • 17. P.-H. Lee, C.-P. Lin, and C.-M. Chen*, JAN 2013, “Retardation of the Cu5Zn8 phase fracture and improvement of shear strength of the Sn-9 wt.% Zn/Cu interface by inserting an electroless Palladium layer”, Metallurgical and Materials Transactions A, Vol. 44A, pp. 125-130. (SCI, IF: 1.73, Ranking: 10/75 in METALLURGY & METALLURGICAL ENGINEERING)
  • 18. S.-H. Lee, C.-F. Lin, and C.-M. Chen*, 2013, “Unusual Void Formation at the Anode-side Interface of a Cu/SnAgCuBi/Cu Solder Stripe under Current Stressing”, Journal of Engineering, National Chung Hsing University, Vol. 24, pp. 25-30. (非SCI但具審查制度之國內期刊)
  • 19. Y.-T. Huang, Y.-Y. Zhan, S.-J. Cherng, C.-M. Chen*, S.-P. Feng, T.-C. Wei, SEP 2013, "Surface metallization of polyimide as a photoanode substrate for rear-illuminated dye-sensitized solar cells", Journal of The Electrochemical Society, Vol. 160, H581-H586. (SCI, IF: 2.859, Ranking: 1/18 in MATERIALS SCIENCE, COATINGS & FILMS)
  • 20. C.-Y. Hsu, S.-J. Cherng, Y.-J. Lin and C.-M. Chen*, NOV 2013, “A Compact Nano-TiO2 Underlayer for Efficient Dye-sensitized Solar Cell”, IEEE Electron Device Letters, Vol. 34, pp. 1415-1417. (SCI, IF: 3.023, Ranking: 29/247 in ENGINEERING, ELECTRICAL & ELECTRONIC)
  • 2012 年
  • 21. T.-C. Wei*, S.-P. Feng, Y.-H. Chang, S.-J. Cherng, Y.-J. Lin, C.-M. Chen, H.-H. Chen, DEC 2012, “Fabrication and Characterization of Interconnected Grid-type Dye-Sensitized Solar Modules”, International Journal of Electrochemical Science, Vol. 7, pp. 11904-11916. (SCI, IF: 1.956, Ranking: 16/27 in ELECTROCHEMISTRY)
  • 22. J.-Y. Wang, C.-F. Lin, and C.-M. Chen*, DEC 2012, “Interfacial reactions and mechanical properties of the Bi-x wt.% Sn/Cu joints (x= 2, 5, and 10)”, Journal of Electronic Materials, Vol. 41, pp. 3303-3308. (SCI, IF: 1.675, Ranking: 83/247 in ENGINEERING, ELECTRICAL & ELECTRONIC)
  • 23. H.-A. Pan, C.-P. Lin, and C.-M. Chen*, SEP 2012, “Interfacial reaction of molten Sn on a strained Cu electroplated layer”, Journal of Electronic Materials, Vol. 41, pp. 2470-2477. (SCI, IF: 1.675, Ranking: 83/247 in ENGINEERING, ELECTRICAL & ELECTRONIC)
  • 24. C.-F. Lin, S.-H. Lee, and C.-M. Chen*, AUG 2012, “Effect of Sn grain orientation on the Cu6Sn5 formation in a Sn-based solder under current stressing”, Metallurgical and Materials Transactions A, Vol. 43A, pp. 2571-2573. (SCI, IF: 1.73, Ranking: 10/75 in METALLURGY & METALLURGICAL ENGINEERING)
  • 25. B.-H. Liou, C.-M. Chen*, R.-H. Horng, Y.-C. Chiang, and D.-S. Wuu, MAY 2012, ”Improvement of thermal management of high-power GaN-based light-emitting diodes”, Microelectronics Reliability, Vol. 52, pp. 861-865. (SCI, IF: 1.214, Ranking: 124/247 in ENGINEERING, ELECTRICAL & ELECTRONIC)
  • 26. C.-P. Lin and C.-M. Chen*, FEB 2012, “Solid-state interfacial reactions at the solder joints employing Ni/Pd/Au and Ni/Au as the surface finish metallizations”, Microelectronics Reliability, Vol. 52, pp. 385-390. (SCI, IF: 1.214, Ranking: 124/247 in ENGINEERING, ELECTRICAL & ELECTRONIC) (Invited paper)
  • 27. C.-M. Chen* and S.-J. Cherng, 2012, “Counterelectrodes for Dye-sensitized Solar Cells”, Global Journal of Physical Chemistry, Vol. 3, 6. (Invited review article)
  • 28. 蔡婷雅、程聖傑、林裕傑、陳志銘*,2012,“在鈦薄板上形成二氧化鈦奈米片/奈米粒之雙層結構作為染料敏化太陽能電池之高效能光電極基板”,化工,第59卷第4期,pp. 35-51。
  • 2011 年
  • 29. J.-Y. Wang, C.-F. Lin, and C.-M. Chen*, APR 2011, “Retarding the Cu5Zn8 phase fracture at the Sn-9 wt.% Zn/Cu interface”, Scripta Materialia, Vol. 64, pp. 633-636. (SCI, IF: 2.968, Ranking: 3/75 in METALLURGY & METALLURGICAL ENGINEERING)
  • 30. C.-M. Chen*, Y.-C. Hsu, and S.-J. Cherng, JAN 2011, “Effects of annealing conditions on the properties of TiO2/ITO-based photoanode and the photovoltaic performance of dye-sensitized solar cells”, Journal of Alloys and Compounds, Vol. 509, pp. 872-877. (SCI, IF: 2.726, Ranking: 5/75 in METALLURGY & METALLURGICAL ENGINEERING)
  • 31. C.-P. Lin, C.-M. Chen*, Y.-W. Yen, H.-J. Wu, S.-W. Chen, FEB 2011, “Interfacial reactions between high-Pb solders and Ag“, Journal of Alloys and Compounds, Vol. 509, pp. 3509-3514. (SCI, IF: 2.726, Ranking: 5/75 in METALLURGY & METALLURGICAL ENGINEERING)
  • 32. Y.-T. Huang, Y.-W. Lin, and C.-M. Chen*, MAY 2011, “Characterization of carbon nanomaterials synthesized from thermal decomposition of paper phenolic board”, Materials Chemistry and Physics, Vol. 127, pp. 397-404. (SCI, IF: 2.129, Ranking: 70/251 in MATERIALS SCIENCE, MULTIDISCIPLINARY)
  • 33. J.-L. Lan, C.-C. Wan, T.-C. Wei, W.-C. Hsu, C. Peng, Y.-H. Chang, and C.-M. Chen*, MAY 2011, “Improvement of Photovoltaic Performance of Dye-Sensitized Solar Cell by Post Heat Treatment of Polymer-Capped Nano-Platinum Counterelectrode”, International Journal of Electrochemical Science, Vol. 6, pp. 1230-1236. (SCI, IF: 1.956, Ranking: 16/27 in ELECTROCHEMISTRY)
  • 34. S.-J. Cherng, C.-M. Chen*, W.-P. Dow, C.-H. Lin, and S.-W. Chen, JUL 2011, “Chemical deposition of Ni/Pt bi-layer on polyimide film as flexible counterelectrodes for dye-sensitized solar cells”, Electrochemical and Solid State Letters, Vol. 14, P13-P15. (SCI, IF: 2.149, Ranking: 69/251 in MATERIALS SCIENCE, MULTIDISCIPLINARY)
  • 35. S.-H. Lee and C.-M. Chen*, SEP 2011, “Electromigration in a Sn-3wt.%Ag-0.5wt.%Cu-3wt.%Bi solder stripe between two Cu electrodes under current stressing”, Journal of Electronic Materials, Vol. 40, pp. 1943-1949. (SCI, IF: 1.675, Ranking: 83/247 in ENGINEERING, ELECTRICAL & ELECTRONIC)
  • 36. W.-K. Liao, C.-M. Chen*, M.-T. Lin, C.-H. Wang, OCT 2011, “Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains”, Scripta Materialia, Vol. 65, pp. 691-694. (SCI, IF: 2.968, Ranking: 3/75 in METALLURGY & METALLURGICAL ENGINEERING)
  • 2010 年
  • 37. C.-M. Chen*, C.-H. Chen, and T.-C. Wei, FEB 2010, “Chemical deposition of platinum on metallic sheets as counterelectrodes for dye-sensitized solar cells”, Electrochimica Acta, Vol. 55, pp. 1687-1695. (SCI, IF: 4.086, Ranking: 4/27 in ELECTROCHEMISTRY)
  • 38. C.-M. Chen*, C.-H. Chen, S.-J. Cherng, and T.-C. Wei, NOV 2010, “Electroless deposition of platinum on indium tin oxide glass as the counterelectrode for dye-sensitized solar cells”, Materials Chemistry and Physics, Vol. 124, pp. 173-178. (SCI, IF: 2.129, Ranking: 70/251 in MATERIALS SCIENCE, MULTIDISCIPLINARY)
  • 39. Y.-W. Lin, P.-Y. Shih, and C.-M. Chen*, MAR 2010, “A current-induced localized heating technique for fabrication of carbon nanomaterials”, Journal of Alloys and Compounds, Vol. 492, pp. 521-524. (SCI, IF: 2.726, Ranking: 5/75 in METALLURGY & METALLURGICAL ENGINEERING)
  • 40. C.-P. Lin, C.-M. Chen*, C.-H. Lin, and W.-C. Su, JUL 2010, “Interfacial reactions of Sn/Ag/Cu tri-layer on a deformed polyimide substrate”, Journal of Alloys and Compounds, Vol. 502, pp. L17-L19. (SCI, IF: 2.726, Ranking: 5/75 in METALLURGY & METALLURGICAL ENGINEERING)
  • 41. J.-S. Hong, R.-H. Horng*, Y.-L. Tsai, D.-S. Wuu, C.-M. Chen, and C.-J. Chen, SEP 2010, “Optimized Thermal Management from Chip to Heat Sink for High-Power GaN-Based Light-Emitting Diodes”, IEEE Transactions on Electron Devices, Vol. 57, pp. 2203-2207. (SCI, IF: 2.358, Ranking: 44/247 in ENGINEERING, ELECTRICAL & ELECTRONIC)
  • 42. S.-J. Cherng, Y.-C. Hsu, and C.-M. Chen*, SEP 2010, “Mitigation of Solvent Evaporation in Dye-Sensitized Solar Cells Based on Liquid Electrolyte by Introducing Regular-fencing-patterned Polymer Films”, Journal of the Chinese Institute of Engineers, Vol. 33, pp. 791-797. (SCI, IF: 0.209, Ranking: 81/87 in ENGINEERING, MULTIDISCIPLINARY)
  • 43. C.-J. Chen, C.-M. Chen*, R.-H. Horng, D.-S. Wuu, and J.-S. Hong, DEC 2010, “Thermal management and interfacial properties in high-power GaN-based light-emitting diodes employing diamond-added Sn-3wt.%Ag-0.5wt.%Cu solder as die attach materials”, Journal of Electronic Materials, Vol. 39, pp. 2618-2626. (SCI, IF: 1.675, Ranking: 83/247 in ENGINEERING, ELECTRICAL & ELECTRONIC) (獲選為Editor's Choice與該月份之Featured Article)
  • 2009 年
  • 44. C.-M. Chen*, H.-S. Shiu, S.-J. Cherng, and T.-C. Wei, MAR 2009, “Preparation of polymer film of micro-porous or island-like structure and its application in dye-sensitized solar cell”, Journal of Power Sources, Vol. 188, pp. 319-322. (SCI, IF: 5.211, Ranking: 2/27 in ELECTROCHEMISTRY)
  • 45. H.-M. Chung, C.-M. Chen*, C.-P. Lin, and C.-J. Chen, OCT 2009, “Microstructural Evolution of the Au-20 wt.% Sn Solder on the Cu Substrate During Reflow”, Journal of Alloys and Compounds, Vol. 485, pp. 219-224. (SCI, IF: 2.39, Ranking: 4/76 in METALLURGY & METALLURGICAL ENGINEERING)
  • 46. C.-P. Lin and C.-M. Chen*, JUN 2009, “Intermetallic compound formation and evolution in the solid-state Sn/immersion-Ag/Cu tri-layer interfacial reactions on a flexible polymer board”, Journal of Electronic Materials, Vol. 38, pp. 908-914. (SCI, IF: 1.635, Ranking: 78/243 in ENGINEERING, ELECTRICAL & ELECTRONIC)
  • 47. C.-M. Chen* and Y.-J. Chen, JUL 2009, “Growth orientation of the tin whiskers on an electrodeposited Sn layer under three-point bending”, Materials Letters, Vol. 63, pp. 1517-1520. (SCI, IF: 2.224, Ranking: 56/241 in MATERIALS SCIENCE, MULTIDISCIPLINARY)
  • 48. C.-M. Chen*, Y.-M. Hung, and C.-H. Lin, MAY 2009, “Electromigration of Sn-8 wt.% Zn-3 wt.% Bi and Sn-9 wt.% Zn-1 wt.% Cu solders”, Journal of Alloys and Compounds, Vol. 475, pp. 238-244. (SCI, IF: 2.39, Ranking: 4/76 in METALLURGY & METALLURGICAL ENGINEERING)
  • 49. C.-M. Chen*, Y.-M. Hung, C.-P. Lin, and W.-C. Su, MAY 2009, “Effect of temperature on microstructural changes of the Sn-9 wt.% Zn lead-free solder stripe under current stressing”, Materials Chemistry and Physics, Vol. 115, pp. 367-370. (SCI, IF: 2.072, Ranking: 61/241 in MATERIALS SCIENCE, MULTIDISCIPLINARY)
  • 50. Y.-J. Chen and C.-M. Chen*, MAR 2009, “Mitigative tin whisker growth under mechanically applied tensile stress”, Journal of Electronic Materials, Vol. 38, pp. 415-419. (SCI, IF: 1.635, Ranking: 78/243 in ENGINEERING, ELECTRICAL & ELECTRONIC)
  • 51. C.-M. Chen*, P.-Y. Shih, and Y.-W. Lin, JAN 2009, “Synthesis of nanostructured carbon materials on a tin thin film using phenol formaldehyde as the carbon source”, Journal of Electronic Materials, Vol. 38, pp. 193-199. (SCI, IF: 1.635, Ranking: 78/243 in ENGINEERING, ELECTRICAL & ELECTRONIC)
  • 52. C.-H. Chen, C.-P. Lin, and C.-M. Chen*, JAN 2009, “Effect of Cu thickness on the evolution of the reaction products at the Sn-9 wt.% Zn solder/Cu interface during reflow”, Journal of Electronic Materials, Vol. 38, pp. 61-69. (SCI, IF: 1.635, Ranking: 78/243 in ENGINEERING, ELECTRICAL & ELECTRONIC)
  • 2008 年
  • 53. C.-M. Chen* and P.-Y. Shih, 2008, “A peculiar composite structure of carbon nanofibers growing on a micro-sized tin whisker”, Journal of Materials Research, Vol. 23(10), pp. 2668-2673.
  • 54. C.-M. Chen*, C.-H. Chen, and C.-P. Lin, and W.-C. Su, 2008, “Morphological evolution of reaction product at Sn-9 wt.% Zn/thin-film Cu interface”, Journal of Electronic Materials, Vol. 37(10), pp. 1605-1610.
  • 55. C.-M. Chen* and C.-C. Huang, 2008, “Effects of silver doping on electromigration of eutectic SnBi solder”, Journal of Alloys and Compounds, Vol. 461, pp. 235-241.
  • 56. Y.-M. Hung and C.-M. Chen*, 2008, “Electromigration of Sn-9 wt.% Zn solder”, Journal of Electronic Materials, Vol. 37, pp. 887-893.
  • 57. C.-M. Chen* and C.-C. Huang, 2008, “Atomic migration in eutectic SnBi solder alloy due to current stressing”, Journal of Materials Research, Vol. 23, pp. 1051-1056.
  • 2007 年
  • 58. C.-M. Chen* and C.-H. Chen, 2007, “Interfacial reactions between eutectic SnZn solder and bulk or thin-film Cu substrates”, Journal of Electronic Materials, Vol. 36, pp. 1363-1371.
  • 59. C.-M. Chen*, C.-C. Huang, C.-N. Liao, and K.-M. Liou, 2007, “Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing”, Journal of Electronic Materials, Vol. 36, pp. 760-765.
  • 60. T.-C. Wei*, C.-C. Wan, Y.-Y. Wang, C.-M. Chen, and H.-S. Shiu, 2007, “Immobilization of poly (N-vinyl-2-pyrrolidone)-capped platinum nano-clusters on indium-tin oxide glass and its application in dye-sensitized solar cells”, Journal of Physical Chemistry C, Vol. 111, pp. 4847-4853.
  • 61. C.-M. Chen*, K.-Z. Wang, and K.-C. Chen, 2007, “Isothermal solid-state aging of Pb-5Sn solder bump on Ni/Cu/Ti under bump metallization”, Journal of Alloys and Compounds, Vol. 432, pp. 122-128.
  • 62. C.-M. Chen*, L.-T. Chen, and Y.-S. Lin, 2007, “Electromigration-induced Bi segregation in eutectic SnBi solder joint”, Journal of Electronic Materials, Vol. 36, pp. 168-172.
  • 2006 年
  • 63. C.-M. Chen* and H.-C. Lin, 2006, “Interfacial reactions and mechanical properties of ball-grid-array solder joints using Cu-cored solder balls”, Journal of Electronic Materials, Vol. 35, pp. 1937-1947.
  • 64. L.-T. Chen and C.-M. Chen*, 2006, “Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization”, Journal of Materials Research, Vol. 21, pp. 962-969.
  • 2005 年
  • 65. K.-Z. Wang and C.-M. Chen*, 2005, “Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with the Ti/Cu/Ni under bump metallization during reflow soldering”, Journal of Electronic Materials, Vol. 34, pp. 1543-1549.
  • 2004 年
  • 66. C.-M. Chen*, S.-W. Chen, J.-J. Ko, and H.-P. Pu, 2004, “Effects of Au and Ni layers on the interfacial reactions of the flip chip solder joints“, Journal of the Chinese Colloid and Interfaces Society, Vol. 26, pp. 119-128. (in Chinese)
  • 67. C.-M. Chen*, J.-J. Ko, and H.-P. Pu, 2004, “Electromigration effects upon flip chip solder joints”, Chemical Engineering, Vol. 51, pp. 80-92. (in Chinese)
  • 2003 年
  • 68. M.-Y. Du, C.-M. Chen, S.-W. Chen*, 2003, “Effects upon interfacial reactions by electric currents of reversing directions”, Materials Chemistry and Physics, Vol. 82, pp. 818-825.
  • 69. C.-M. Chen and S.-W. Chen*, 2003, “Electromigration effects upon the low-temperature Sn/Ni interfacial reactions”, Journal of Materials Research, Vol. 18(6), pp. 1293-1296.
  • 70. J.-I. Lee, S.-W. Chen*, H.-Y. Chang and C.-M. Chen, 2003, “Reactive Wetting between Molten Sn-Bi and Ni Substrate”, Journal of Electronic Materials, Vol. 32(3), pp. 117-122.
  • 71. S.-W. Chen* and C.-M. Chen, 2003, “Electromigration Effects upon Interfacial Reactions”, JOM, Vol. 55(2), pp. 62-67.
  • 2002 年
  • 72. C.-M. Chen and S.-W. Chen*, 2002, “Electromigration Effect upon the Sn/Ag and Sn/Ni Interfacial Reactions at Various Temperatures”, Acta Materialia, Vol. 50, pp. 2461-2469.
  • 2001 年
  • 73. C.-M. Chen and S.-W. Chen*, 2001, “Electromigration Effect upon the Sn-0.7wt%Cu/Ni and Sn-3.5wt%Ag/Ni Interfacial Reactions”, Journal of Applied Physics, Vol. 90(3), pp.1208-1214.
  • 2000 年
  • 74. C.-M. Chen and S.-W. Chen*, 2000, “Electromigration Effect upon the Zn/Ni and Bi/Ni Interfacial Reactions”, Journal of Electronic Materials, Vol. 29(10), pp. 1222-1228.
  • 75. S.-W. Chen*, C.-S. Ho, C.-H. Lin and C.-M. Chen, 2000, “The 900℃ Isothermal Section of Ti-Ni-V Alloys”, Metallurgical and Materials Transactions A, Vol. 31A, pp. 1679-1682.
  • 1999 年
  • 76. C.-M. Chen and S.-W. Chen*, 1999, “Electric Current Effects on Sn/Ag Interfacial Reactions”, Journal of Electronic Materials, Vol. 28(7), pp. 902-906.
  • 77. 陳志銘,陳信文*,1999,“銲料與界面反應”,材料會訊,Vol. 6(2), pp. 74-80.
  • 1998 年
  • 78. S.-W. Chen*, C.-C. Lin and C.-M. Chen, 1998, “Determination of the Melting and Solidification Characteristics of Solders Using Differential Scanning Calorimetry”, Metallurgical and Materials Transactions A, Vol. 29A, pp. 1965-1972.
  • 79. S.-W. Chen*, C.-M. Chen, and W.-C. Liu, 1998, “Electric Current Effects upon the Sn/Cu and Sn/Ni Interfacial Reactions”, Journal of Electronic Materials, Vol. 27(11), pp. 1193-1198.
  • 80. W.-C. Liu, S.-W. Chen*, and C.-M. Chen, 1998, “The Al/Ni Interfacial Reactions under the Influence of Electric Current”, Journal of Electronic Materials, Vol. 27(1), pp. L5-L8.
  • B. 專書及專書論文
  • 1. S.-W. Chen, C.-M. Chen, C.-H. Wang and C.-M. Hsu, “Effects of electromigration on electronic solder joints”, Chapter 16 in the book, "Lead-free solders: materials reliability for electronics", John Wiley & Sons, 403-424, (2012). (ISBN: 978-0-470-97182-6)
  • 2.「微系統構裝基礎原理」,2003,高立圖書有限公司
  • 3.「電子構裝材料與技術」,2004,高立圖書有限公司
  • C. 得獎紀錄與榮譽
  • 1. 2014年國立中興大學工學院興大工程學刊論文獎
  • 2. 2014年國立中興大學工學院「專題研究成果競賽佳作」指導老師(指導學生:吳建衡)
  • 3. 2013年「國立中興大學優秀年輕學者獎助計畫-懷璧獎 (Outstanding Young Faculty Grant Project)」
  • 4. 2013-2016年「國科會優秀年輕學者研究計畫 (Outstanding Young Faculty Research Project)」
  • 5. 2013年國立中興大學「優良導師」
  • 6. 2013年國立中興大學工學院「優良導師」
  • 7. 2013年國立中興大學工學院「專題研究成果競賽佳作」指導老師
  • 8. 2013年IMPACT優秀論文獎「優等」(IMPACT Outstanding Paper Award 2013-Merit Prize)
  • 9. 2012年「李謀偉福聚教育基金會學術研究傑出教授獎 (Excellent Professor Award)」
  • 10. 2012年「台灣奈米影像暨奈米新詩創作競賽-掃描式電子顯微鏡影像組」-「金牌獎」
  • 11. 2012年台灣化學工程學會年會(台中,逢甲大學),「海報論文競賽佳作」
  • 12. 2012年中國材料科學學會年會(雲林,虎尾科技大學),「海報論文競賽佳作」
  • 13. 2011年國立中興大學「研究績優獎 (Academic Research Excellence Award)」
  • 14. 2011年國立中興大學「教學特優教師I (Distinguished Teaching Award I)」
  • 15. 2011年國立中興大學工學院「教學教師傑出獎」
  • 16. 2011年國立中興大學工學院99學年度教師評鑑:評鑑優良獎及服務績優獎
  • 17. 2011年台灣化學工程學會年會(台南,成功大學),「海報論文競賽優等獎」
  • 18. 2011年Top Reviewer of Microelectronics Reliability
  • 19. 2010年國立中興大學「傑出青年教師」
  • 20. 2010年國立中興大學工學院「青年教師傑出獎」
  • 21. 2009年台灣化學工程學會年會(台中,中興大學)「海報論文競賽優等獎」
  • 22. 2008年台灣化學工程學會「學術勵進獎」
  • 23. 2007年美國礦物、金屬與材料學會「Young Leader Professional Development Award」。(TMS, The Minerals, Metals & Materials Society, USA).
  • 24. 2007年台灣奈米影像競賽,掃描式電子顯微鏡(SEM)影像組「佳作」
  • 25. 2007年台灣化學工程學會年會(林口,長庚大學)「海報論文競賽優等獎」
  • 26. 2007年中國材料科學學會年會(新竹,交通大學)「海報論文競賽佳作」
  • 27. 2007年TPCA (Taiwan Printed Circuit Association, Taipei, Taiwan),「Outstanding PCB Thesis Award」.
  • 28. 2006年TPCA (Taiwan Printed Circuit Association, Taipei, Taiwan),「Outstanding PCB Thesis Award」.
  • 29. 2006年台灣化學工程學會年會(高雄,義守大學),「海報論文優等獎」
  • 30. 2005年中國材料科學學會年會(台北,淡江大學),「海報論文優等獎」
  • D. 學術服務
  • 1. 2013年起Editorial Board Member of Scientific World Journal (SCI, Hindawi)
  • 2. 2012年起Editorial Board Member of Journal of the Taiwan Institute of Chemical Engineers (SCI, Elsevier)
  • 3. 2012年Lead Guest Editor of a special issue “Metallurgy Materials for Energy Application (MMEA)” in Journal of Metallurgy (Hindawi)
  • 4. 2010年起Editorial Board Member of Global Journal of Physical Chemistry (Simplex Academic Publishers)
  • 5. 2009年起Lead Guest Editor of Journal of Electronic Materials (SCI, Springer)
  • 6. 2009年起Symposium Lead-Organizer of TMS Annual Meeting
  • 7. 2009年起「興大工程學刊」編輯委員
  • E. 專利
  • 1. 「製備奈米碳材與含有該奈米碳材的基板與高分子膜的方法及其應用」,中華民國專利,發明第I 367860號(2012/7/11~2028/10/1)
  • 2. 「染料敏化太陽能電池之光電極基材的製造方法」,中華民國專利-100128894,已核准(獲證中)
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