研究成果


國際期刊:


.Ya-Chi Cheng,Yu-Ting Wang, Feng-Chih Hsu, Fang-Ching Lu, Chung-Lin Wu, and Ming-Tzer Lin* (2014, Nov). Effect of Loading Stress on the Growth of Cn/Sn Intermetallic Compounds at High Temperatures. Journal of Electronic Materials. SCI
.Yu-Ting Wang, Chi-Jia Tong, Yun-Fu Shieh, Ya-Chi Cheng, Fan-Chun Hsieh, Ming-Tzer Lin* (2014, Jul). Effect of temperature on energy loss and internal friction in nanocrystalline copper thin films. Surface and Coatings Technology. SCI
.Feng-Chih Hsu, Ya-Chi Cheng, Yu-Ting Wang, Ming-Tzer Lin*, Chih-Ming Chen (2014, Jun). Planar copper-tin inter-metallic film formation on strained substrates. Microelectronics Reliability .SCI
.Feng-Chih Hsu, Yu-Ting Wang, Ya-Chi Cheng, Chi-Jia Tong, and Ming-Tzer Lin* (2014, Mar). The study of internal friction in nanocrystalline Ag and Au thin films. Thin Solid Films. SCI
.T.-C. Hu, Y.-T. Wang, F.-C. Hsu, P.-K. Sun, M.-T. Lin* (2013, Jan). “Cyclic creep and fatigue testing of nanocrystalline copper thin films” Surface & Coating Technology, Volume 215, 25 January 2013, Pages 393–399, SCI
.TIEN-CHEN HU,FENG-CHIH HSU, AN-WEN HUANG, and MING-TZER LIN* (2012, Dec). Influence of External Strain on the Growth of Interfacial Intermetallic Compounds Between Sn and Cu Substrates. Journal of ELECTRONIC MATERIALS, Vol. 41, No. 12, 2012, p3309-3319. SCI
.Yu-Ting Wang, Tien-Chen Hu,Chi-Jia Tong,Ming-Tzer Lin* (2012, Nov). Novel full range vacuum pressure sensing technique using free decay of trapezoid micro-cantilever beam deflected by electrostatic force. MicrosystemTechnologies, (2012) 18:1903–1908. SCI
.Hui Huang Cheng, De-Shau Huang, Ming-Tzer Lin* (2012, May). Heat dissipation design and analysis of high power LED array using the finite element method. Microelectronics Reliability, Volume 52, Issue 5, Pages 905-911. SCI, EI
.Wei-Tzuo Lin, De-Shau Huang, *Ming-Tzer Lin (2011, Apr). The thermal evaluation of the substrate mixed with microencapsulated phase change materials for MEMS packaging applications. Microsystem Technologies, Volume 17, Issue 4, pp 693-699. SCI
.Ya-Chi Cheng, Chi-Jia Tong, Ming-Tzer Lin* (2011, Apr). Measurement of Static and Dynamic Mechanical Behavior of Micro and Nano-Scale Thin Metal Films: Using Micro-Cantilever Beam Deflection. Microsystem Technologies, Volume 17, Issue 4, pp 721-730 . SCI
.W.-K. Liao, C.-M. Chen, *M.-T. Lin, C.-H. Wang, (2011),“Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains” Scripta Materialia, Vol. 65 P.691-694 SCI, EI
.Chao-Chi Chang, De-Shau Huang, *Ming-Tzer Lin, Ray-Hua Horng, Chi-Ming Lai“Novel Heat Dissipation Design for Light Emitting Diode Applications” MICROSYSTEM TECHNOLOGIES , April 2010,519-526, SCI, EI
.Chi-Jia Tong, Ya-Chi Cheng, *Ming-Tzer Lin, Kuan-Jung Chung, Jiong-Shiun Hsu, Chung-Lin Wu, Online 2010 Jan. “Optical Micro-Paddle Beam Deflection Measurement for Electrostatic Mechanical Testing of Nano-Scale Thin Film Application to MEMS” MICROSYSTEM TECHNOLOGIES ,DOI: 10.1007/s00542-009-0999-7 (online), SCI, EI
.De-Shau Huang, Jiye-Siang Shih, Hung-Chih Hsia, *Ming-Tzer Lin, 2010“Three-Phase Linear Motor Heat Transfer Analysis Using the Finite Element Method” HEAT TRANSFER ENGINEERING, Vol. 31, Issue 7,7June 2010, 617-624, SCI, EI
.Ming-Tzer Lin, Chi-Jia Tong, Kai-Shiang Shiu, 2009 “Novel microtensile method for monotonic and cyclic testing of freestanding copper thin films” EXPERIMENTAL MECHANICS, January 2010,55-64 ,SCI, EI
.Po-Hsun Tseng, Chi-Jia Tong, *Ming-Tzer Lin, 2009 Sep. “Design a fast tracking resolver to digital conversion method using FPGA for rotary motion applications” JOURNAL OF THE CHINESE INSTITUTE OF ENGINEERS, Vol. 32, Issue 6, 745-753, SCI, EI
.Chi-Jia Tong & *Ming-Tzer Lin 2009 Aug. “Design and development of a novel paddle test structure for the mechanical behavior measurement of thin films application for MEMS” MICROSYSTEM TECHNOLOGIES, Vol. 15, Issue 8, 1207-1216, SCI, EI
.Ming-Tzer Lin, Chi-Jia Tong & Kai-Shiang Shiu, 2008 Aug “Monotonic and fatigue testing of freestanding submicron thin beams application for MEMS" MICROSYSTEM TECHNOLOGIES, 14, Number 7 1041-1048 SCI, EI
.Ming-Tzer Lin, Chi-Jia Tong & Chung-Hsun Chiang, 2007, July “Design and Development of Sub-micron scale Specimens with Electroplated Structures for the Microtensile Testing of Thin Films” MICROSYSTEM TECHNOLOGIES Vol.13,1559-1565 SCI, E
.Ming-Tzer Lin, R.Chromik, N. Barbosa III, P. El-Deiry, S. Hyun, W. L. Brown, R. P. Vinci, T. J. Delph, 2007, July “The Influence of Vanadium Alloying on the High-Temperature Mechanical Properties of Thin Gold Films” THIN SOLID FILMS Volume 515, Issues 20-21, P 7919-7925 SCI, EI
.Ming-Tzer Lin, R. Chromik, N. Barbosa, P. El-Deiry, R Vinci,Walter L. Brown, T.J. Delph, 2006 SEP “Temperature Dependent Microtensle Testing of Thin Film Materials for Application to MEMS” MICROSYSTEM TECHNOLOGIES Vol.12 (10-11): 1045-1051 SCI, EI
.D. Pierreux a, *A. Stesmans a,, R.J. Jaccodine, M.-T. Lin, T.J. Delph, 2004, April “Electron spin resonance study of the effect of applied stress during thermal oxidation of (1 1 1) Si on inherent Pb interface defects” MICROELECTRONIC ENGINEERING 72 (2004) 76~80 SCI, EI
.A. Stesmans, D. Pierreux, R J Jaccodine, M.-T. Lin, T. J. Delph, 2003, May “Influence of in situ applied stress during thermal oxidation of (111)Si on Pb interface defects” APPLIED PHYSICS LETTERS Vol. 82, No. 18, 3038~3040 SCI, EI
.M.-T. Lin, T J Delph, R J Jaccodine, 2001, March “Planar Oxidation of Strained Silicon Substrates” JOURNAL OF MATERIALS RESEARCH Vol. 16, No. 3, 728~733 SCI, EI
.T J Delph & *M.-T. Lin, 1999, December “Intrinsic Stress Effects on the growth of Planar SiO2 Films” JOURNAL OF MATERIALS RESEARCH Vol. 14, No. 12, 4508~4513 SCI, EI
.Yan-Ting Chen, Ya-Chi Cheng, Kuan-Jung Chung, *Ming-Tzer Lin 2008, Oct "Mechanical Property Measurement of Nano-Scale Metal Films on the Novel Paddle Cantilever Beams Using Four Step Phase-Shifting Method” IEEE EXPLORE SYMPOSIUM PROCEEDING OF IMPACT 2008 (NSC96-2221-E-005-082) EI
.Ming-Tzer Lin, Chi-Jia Tong & Chung-Hsun Chiang, 2006, April “Design an Electroplated Frame Freestanding Specimen for Microtensile Testing of Submicron thin TaN and Cu Film” MATER. RES. SOC. SYMP. PROC. VOL. 914 © 2006 Materials Research Society (NSC93-2212-E-005-014) EI


國際研討會論文:


.Chen-Hua Lue, Chien-Hua Chen,An-Wen Huang, *Ming-Tzer Lin 2015 Jun “Recent Optical Measurement for the Mechanical Properies of Thin Flims”, “Time and Temperature Dependence of Stress Relaxation in Al and Al Alloy Thin Films Application for MEMS”2015 SEM conference ,Costa Mesa, California, USA
.Ming-Tzer Lin 2014 Jul “Structure Design Dynamic Testing and Analysis on the Micro Piezoelectric Vacuum Gauge” 2014 ICEM conference ,Cambridge, England.
.Ming-Tzer Lin 2014 Nov “Recent development of using optical methods to measure the mechanical properties of thin films” 2014 ISOT conference ,Seattle, USA
.Zhou-Cheng Wu, Yu-Ting Wang, *Ming-Tzer Lin 2014 Jun “In Situ Energy Loss and Internal Friction Measurement of Nanocrystalline Copper Thin Films Under Different Temperature”, 2014 SEM conference ,Greenville, South California, USA
.Yi-Sheng Liao, Fang-Jui Kuo, *Ming-Tzer Lin 2014 Apr “Evaluating heat dissipation in edge-lit LED backlight module using taguchi method” 2014 DTIP conference ,Cannes, France.
.Fang-Jui Kuo, Zhou-Cheng Wu, *Ming-Tzer Lin 2013 Jun “Temperature Dependent Micromechanical Testing on the Formation of Cu/Sn Intermetallic Thin Films” 2013 SEM conference ,Lombard,Illinois, USA
.Yu-Ting Wang, Ya-Chi Cheng, *Ming-Tzer Lin 2012 May“Cyclic Creep and Fatigue Testing of Nanocrystalline Copper Thin Films” 2012 ICMCTF conference ,San Diego, USA.
.Ya-Chi Cheng, Chi-Jia Tong, Peng-Chih Chen, Kuan-Jung Chung, *Ming-Tzer Lin 2009 Oct “Mechanical Properties Measurement of Nano-scale Films on the Novel Paddle Cantilever Beam Using Laser Deflection” 2009 IMPACT conference Taipei, Taiwan.
.Ming-Tzer Lin, Chi-Jia Tong, Ya-Chi Cheng, Kuan-Jung Chung, Jiong-Shiun Hsu 2009 Jun ”Measure the Mechanical Behavior of Thin Films Using Four Step Phase-Shifting Methods on The Novel Paddle Cantilever Beam” 2009 SEM conference Albuquerque, NM, USA.
.Ming-Tzer Lin, Chi-Jia Tong, Kai-Shiang Shiu “Cyclic Creep Behavior of submicron Metal Thin Films due to Tensile Mean Stresses” 2009 SEM conference Albuquerque, NM, USA.
.Zi-Yi Wang, Chi-Jia Tong, *Ming-Tzer Lin 2009 Feb “Microtensile Testing of Sn-Cu and Sn-IMC-Cu Lead Free Solder Films for Packaging Applications” 2009 TMS conference San Francisco, CA, USA
.Ming-Tzer Lin, Chi-Jia Tong, Yan-Ting Chen, Kuan-Jung Chung, Jiong-Shiun Hsu 2009 April ” Mechanical properties study of nano-scale thin films on the novel paddlecantilever using optical interferometer with four step phase-shifting method” 2009 Symposium Proceeding on Design, Test, Integration and Packaging of MEMS/MOEMS, Rome, Italy
.Ming-Tzer Lin, Chao-Chi Chang, Ray-Hua Horng, De-Shau Huang, Chi-Ming Lai 2009 Apr ”Heat dissipation performance for the application of light emitting diode” 2009 Symposium Proceeding on Design, Test, Integration and Packaging of MEMS/MOEMS, Rome, Italy
.Measurement of the Mechanical Properties of Thin Film Using a Novel Paddle Cantilever", Ming-Tzer Lin, Chi-Jia Tong. SEM conference Orlando, FL, USA(2008)
.Tensile Monotonic and Fatigue Testing of Spring-bridge Thin Film Specimen Application for MEMS", Ming-Tzer Lin, Chi-Jia Tong & Kai-Shiang Shiu. SEM conference Orlando, FL, USA(2008)
.Mechanical Property Measurement of Nano-Scale Metal Films on the Novel Paddle Cantilever Beams Using Four Step Phase-Shifting Method", Yan-Ting Chen et al. IEEE Xplore proceeding of IEEE IMPACT and EMAP Conference Proceedings,Taipei,Taiwan(2008)
.Process nano scale mechanical properties measurement of thin metal films using a novel paddle cantilever test structure". Chi-Jia Tong ,Ming-Tzer Lin, DTIP,Nice,France(2008)
.Novel mechanical properties measurement of thin metal films using paddle cantilever deflection". Chi-Jia Tong, Ming-Tzer Lin et al. Thin film,Singapore(2008)
.Microtensile testing of gold and gold-vanadium thin films at elevated temperatures" ,Ming-Tzer Lin, R.R. Chromik, et al . Proceedings of the Seventh International Congress on Thermal Stresses, Taipei, Taiwan, Volume 1 P.325~P.328 ISBN-13:978-986-00-9556-2 June 4-7(2007)
.Micro scale monotonic and tension fatigue testing of spring-bridge freestanding thin films application for MEMS" ,Ming-Tzer Lin, Chi-Jia Tong & Kai-Shiang Shiu. Symposium Proceeding on ATEM’07, JSME-MMD, The International Conference on Advanced Technology in Experimental Mechanics, Fukuoka, Japan (NSC94-2218-E-005-019) Sep. 12-14 (2007)
.Design an Electroplated Frame Freestanding Specimen for Microtensile Testing of Submicron thin TaN and Cu Film." Ming-Tzer Lin,Chi-Jia Tong,Chung-Hsun Chiang. Materials Research Society Symposium Proceedings Vol. 914,Pages191-196(2006)
.Temperature Dependent Microtensle Testing of Thin Film Materials for the Application of MEMS" ,Ming-Tzer Lin, et al, Symposium Proceeding on Design, Test, Integration and Packaging of MEMS/MOEMS Montreux, Switzerland P.114~118 ISBN:2-84813-0357-1 June (2005)




國內研討會論文:


.林威佐、*林明澤、賴啟銘、黃德劭 九十八年十一月二十一日“內含相變化微膠囊的建築材料之儲能溫控研究”中國機械工程學會第二十六屆全國學術研討會論文集 台南成功大學
.夏宏誌、*林明澤、黃德劭、李幸男 九十八年十一月二十一日 “以熱阻模型與有限元素法分析線性同步馬達之熱傳行為”中國機械工程學會第二十六屆全國學術研討會論文集 台南成功大學
.鄭雅琪、*林明澤 九十八年十一月十三日“以單點雷射量測微槳型懸臂樑形變方法探討鋁薄膜材料機械行為”第三十三屆全國力學會議論文集 苗栗聯合大學
.林明澤、鄭雅琪、鍾官榮 九十八年七月九日“以光學單點雷射量測等應力懸臂樑形變方法探討奈米尺度下之薄膜材料機械行為”第十屆奈米工程暨微系統技術研討會論文集 新竹交通大學
.林明澤、鄭雅琪、鍾官榮、徐炯勛 九十八年七月九日“以光學干涉量測等應力微槳型懸臂樑形變方法探討微米尺度下銅薄膜材料機械行為” 第十屆奈米工程暨微系統技術研討會論文集 新竹交通大學
.王子義、童麒嘉、林明澤 九十六年十一月二十三日“以微拉伸試驗量測微米尺度下錫與銅及錫銅介金屬之材料機械性質”第二十四屆中國機械工程學會
.童麒嘉、許凱翔、王子義、林明澤 九十五年“建構一新穎之微拉伸試驗機制以量測次微米尺度薄膜材料之機械性質”第十屆奈米工程暨微系統技術研討會
.童麒嘉、江忠勳、林明澤 九十五年十一月二十四日“以新微拉伸設備量測次微米尺度材料機械性質”中國機械工程學會第二十三屆全國學術研討會論文集台南崑山科技大學
.童麒嘉、許凱翔、王子義、林明澤 九十五年十一月三十日“以一新微拉伸試驗方法量測微系統製程中次微米薄膜材料之機械性質” 第十屆奈米工程暨微系統技術研討會論文集 新竹工研院.


專書論文:


.科儀新知雙月刊九十七年二月,"Vol. 162, Issue 29, No. 4, 85~94設計非破壞性拉伸方法量測薄膜機械行為"
.量測會刊,"微奈米尺度薄膜材料機械性質量測與檢測技術發展研究與新式量測方法之介紹"(2009年)
.微系統暨奈米科技協會會刊,"以新式實驗方法探討應用於微機電元件之微奈米薄膜材料的新穎機械行為"(2009年)
.碩士學位論文,"以新式微拉伸設備量測次微米尺度材料機械性質"(2006年)


優良表現:


.本研究團隊以“Novel mechanical properties measurement of thin metal films using paddle cantilever deflection” 論文於2008年7月13~16日於新加坡舉行之Thin film 2008 and NanoMan 2008國際薄膜會議中在大會五百篇國際論文中脫穎而出入選大會最佳 top 10 final list poster並獲獎狀一只
.本實驗室研究生童麒嘉於碩士期間獲“教育部顧問室奈米科技人才培育計畫辦公室計畫「奈米科技國際化人才培育專案」補助至美國Center for Advanced Materials and Nanotechnology, Lehigh University進行短期研習”
.研究團隊研究生許凱翔等參加教育部顧問室台大精密檢測設備教學資源中心九十五年度精密檢測技術學生專題實作競賽榮獲得佳作。
.本實驗室研究生夏宏誌參加中興大學工學院九七年度「學生論文競賽」佳作。
.本實驗室已畢業碩士班研究生之優異就業表現(一位直升博士班、五位任職於台積電、三位任職於上銀科技、 一位任職於奇美電、一位即將赴美進修博士班、餘服役中) 。


專利:


.薄膜承載片及薄膜性質量測系統", 林明澤 童麒嘉 I354785, 2011/12/21
.薄膜承載片及薄膜拉伸試驗系統", 林明澤 童麒嘉 許凱翔I354786, 2011/12/21
.一種依據振幅變化量測真空度的裝置與其方法", 林明澤 童麒嘉 陳冠綸 (專利申請中)
.導光板模仁製程", 1. 韓斌 林明澤 鄭武雄 陳偉哲 童麒嘉 I341398, 2011/05/01, 2011/12/21